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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 18, 2020 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Some years, the middle of December is marked by a distinct lack of news in PCB design, fabrication and assembly. Much of the industry often takes off around this time to get a head start on the holidays, or to squeeze in a much-needed vacation.
But 2020 is not one of those years. Most of us aren’t traveling anywhere farther than the refrigerator this year, and everyone seems to still be working, albeit from their home offices. And companies in the PCB community continue to make news.
This week, some of our more popular items were related to trade shows, conferences, and DoD PCBs, as well as some good semiconductor market news and a name change for a big EDA company.
We’ve all been through a lot of changes this year—don’t even get me started! But I’ve enjoyed bringing you the news and information that you all need to know during these crazy times.
I hope you all have a great holiday!
Dr. John Mitchell on IPC APEX EXPO Going Virtual
Published December 16
In this breaking interview, Barry Matties, and IPC President and CEO John Mitchell discuss the organization’s decision to switch IPC APEX EXPO to an all-virtual platform in March. We hate to see this kind of thing happen, but with the global COVID-19 travel restrictions in place, IPC is doing the right thing. How would you like to be a trade show manager in 2020?
Mentor Officially Changes Name to Siemens EDA
Published December 14
Mentor, a Siemens business, will be known as Siemens EDA as of January 2021. The company remains a part of Siemens Digital Industries Software. This change has been in the works for a while, as the company wraps up the integration of Mentor into the Siemens community. This may be the final nudge needed for those of us who still refer to the company as Mentor Graphics.
Defense Speak Interpreted: What’s a VITA?
Published December 15
Denny Fritz has a great column on military PCBs. Have you ever wondered how military technicians swap out failed PCBs quickly? How do defense depots keep enough PCBs on hand for the many systems in use, especially during times of heavy training or combat? As Denny explains, the DoD has been worrying about the “quick change” issue for decades, and much of their plan revolves around so-called “VITA” standards, which cover everything from tech requirements to patent policies.
Happy Holden: ECWC15 Virtual Event a Success
Published December 15
Our own Happy Holden gave a keynote presentation at the 15th Electronic Circuits World Convention. He’s attended every one of these events since 1988, but this was his first time attending virtually. In this article, Happy reviews the presentations by fellow keynote speakers, Dr. Hayao Nakahara of N.T. Information Ltd. and James Tam of Bosch, as well as his own talk on the subject of vertical conductive structures (VeCS), a new process which permits the routing of traces vertically through the PCB stackup.
Semiconductor Equipment Consensus Forecast: Record Growth Ahead
Published December 16
In a bit of good news for a related industry, SEMI is predicting record growth in sales of semiconductor manufacturing equipment over the next few years. SEMI’s Year-end Total Semiconductor Equipment Forecast—OEM Perspective puts that total market segment at $72 billion in 2021 and $76 billion in 2022. The organization also projects that China, Taiwan, and Korea will take the lead in semiconductor equipment investment this year.
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Building Electronics Excellence in India
09/08/2025 | Nolan Johnson, SMT007 MagazineFor over two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.
TRI's AI-Powered Inspection Solutions at SMTAI 2025
09/02/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems, will be joining the SMTA International Exposition & Conference. The event will be held from October 21 – 23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.