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USI Gets Green Light on Bond Issuance to Raise Capital
December 30, 2020 | USIEstimated reading time: Less than a minute

Universal Scientific Industrial (Shanghai) Co. Ltd’s (USI) application to offer convertible corporate bonds has been approved by the China Securities Regulatory Commission (CSRC).
USI plans to issue the bonds with a 6-year maturity to raise RMB3.45 billion yuan ($528 million) capital, which it intends to use for chip module production in its Shengxia factory, electronic product manufacture in its Huizhou factory, and wearable device manufacture in its Vietnam factory.
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Redwire Announces Contract to Deliver Stalker Uncrewed Aerial Systems to Another European NATO Ally
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India’s Aerospace and Defence Engineered for Power, Driven by Electronics
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Variosystems Strengthens North American Presence with Southlake Relaunch 2025
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Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
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