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Top 10 Most-Read SMT Articles of 2020
December 31, 2020 | I-Connect007Estimated reading time: 3 minutes
As 2020 comes to a close, the I-Connect007 Editorial Team takes a look back at its most read articles. Here are the top 10 reads in SMT from the past year.
1. MTV Offers Solder Paste Testing Solution
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.
2. Will Moisture Management Expand to the U.S. Market?
Rich Heimsch, Super Dry director, chats with Nolan Johnson about the growing demand for moisture management in North America versus its earlier adoption in Europe, and how moisture management fits into Industry 4.0 and the smart factory.
3. Stencils: Not As Simple As They Seem
Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.
4. This Month in SMT007 Magazine: Exclusive Interview With Burt Rutan, Aerospace Legend
If you follow advancements in aerospace technologies and expeditions, then you know the name Burt Rutan. Described by Newsweek as “the man responsible for more innovations in modern aviation than any living engineer,” Rutan is a bold visionary with a passion for the advancement of technology, who has designed 46 aircraft throughout his career. Following his IPC APEX EXPO keynote presentation, Rutan stopped by the I-Connect007 booth and shared his thoughts on a wide variety of topics.
5. I-007e Micro Webinar: Primary Flight Control Case Study on Condensation and Coverage
The seventh episode of the popular webinar series “Coatings Uncoated!” is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
6. IPC APEX EXPO 2020 Attendees Speak: Travis Smith and Mindy Sanchez
"I’m seeing a lot of great manufacturers and different equipment that’s available in the market, as well as new, emerging technologies," said Travis Smith of Ball Aerospace. "I’m learning a lot more about some of IPC’s standards and committees as well. It has been a fantastic week of educating ourselves for manufacturing processes going forward. And the IPC booth has a wealth of information."
7. I-007e Micro Webinars Releases Part 4 in ‘Coatings Uncoated!’ Series
What is creepage, and how does it impact clearance? Can conformal coatings reduce creepage? The fourth episode of the popular webinar series, Coatings Uncoated, is now available to view. Author of The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation.
8. Solder Paste Printing From the Stencil’s Perspective
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.
9. IPC’s Shawn Dubravac: COVID-19 Outbreak Accelerates Industry Shifts Already Under Way
On May 19, Barry Matties spoke with Shawn Dubravac, chief economist for IPC. While discussing other topics, Matties asked for Dubravac’s perspective on shifts in the market, who observed that the recessionary trend might be behind us; the markets are already showing recovery. Still, it could take a year or so to fully recover.
10. KYZEN’s Tom Forsythe: The Effects of COVID-19
On May 7, Barry Matties and Tom Forsythe, executive vice president at KYZEN, discussed the effects of COVID-19. During the conversation, Forsythe addressed KYZEN’s strategy to keep the staff and employees healthy as the foremost concern. He also detailed recent changes in interacting with customers and his take on what will be the new long-term changes in how the company does business versus short-term accommodations.
Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.