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EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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SMTA Capital Chapter Hosts Free Webinar with BTU's Fred Dimock
January 7, 2021 | SMTAEstimated reading time: 1 minute
The SMTA Capital Chapter is excited to host the first chapter webinar of 2021 on January 20th at 11:00 a.m. EST. Fred Dimock, BTU International, will be presenting “Operation of a Vacuum Reflow Oven with Updated Void Reduction Data.”
This presentation is a sequel to the preliminary data Fred provided to the chapter in early 2019 and will include an overview of the vacuum reflow process and an explanation of why vacuum reflow is of interest to the electronic assembly industry. The presentation will discuss finalized data from the vacuum reflow void reduction experiment completed at the Universal Instruments Process Laboratory and results from live demonstrations at ACI Technology. The live demonstrations will include reworked boards that had been previously processed without vacuum reflow and Fred will describe the refinements that have been made to subsequent vacuum furnaces.
Fred Dimock, Manager of Process Technology at BTU International, has extensive experience in thermal processing and has assisted many companies with process refinements over the years. Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. He also wrote the chapter on solder reflow for the “Handbook of Electronic Assembly and A Guide to SMTA Certification” by Dr. Lasky and Jim Hall. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.
Given these difficult times the Capital Chapter officer team is happy to provide this webinar to all attendees at no charge.
To RSVP, visit smta.org or the Capital Chapter site.
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.