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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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Aspocomp Appoints Antti Ojala as COO
January 7, 2021 | AspocompEstimated reading time: Less than a minute

Antti Ojala, a member of Aspocomp Group Plc’s Management Team, vice president for business development, and deputy CEO, has been appointed as chief operating officer (COO) of the company effective January 7, 2021.
Meanwhile, Jari Isoaho, COO and a member of the Management Team, will leave his position in the company on January 7. He joined Aspocomp in 1989 and has been a member of the Management Team since 2011.
“We sincerely thank Jari for his valuable and long contribution to the company over the past 30 years and wish him all the best for his future,” comments Mikko Montonen, Aspocomp President and CEO.
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04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
Hitachi Announces Completion of New Production Facility for Semiconductor Manufacturing Equipment
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Paige Fiet: From Emerging Engineer to Quality at TTM
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IPC APEX EXPO 2025: And So It Begins
03/18/2025 | Nolan Johnson, I-Connect007The IPC APEX EXPO 2025 show floor opens today, but technical, educational, and, of course, standards committee work has been underway during the preceding weekend. In typical spring fashion, the weather has vacillated between sunny and warm to a spot of rain late on Monday afternoon just as many conference goers were headed back to their nearby hotels.