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Advanced Electronics Packaging Digest

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Filtronic Secures $8M Follow-On Order for mmWave Satellite Payloads

09/22/2026 | Filtronic
Filtronic plc, the designer and manufacturer of advanced RF solutions for the space, aerospace, defence and telecoms infrastructure markets, has secured a follow-on contract with a US-based customer for the design, development and build of prototype units to be deployed on satellites, with a total contract value of $8m (£5.9m).

SEALSQ, WISeKey Expand Quantum Highway from Silicon to Space

09/22/2026 | Globe Newswire
The SEALSQ–WISeKey Quantum Highway™ is designed to connect specialized centers of excellence rather than concentrate critical technologies in a single location.

AT&S, Marvell Expand Collaboration for Next-Gen AI Infrastructure

09/22/2026 | AT&S
AT&S announced an expanded collaboration with Silicon Valley company Marvell Technology, a leading provider of data infrastructure semiconductor solutions, to increase advanced IC substrate capacity for next-generation AI and cloud infrastructure.

SkyWater Technology, Qolab Announce Midwest Commercial Foundry Partnership

09/21/2026 | SkyWater
SkyWater Technology and Qolab announced a multi-year commercial collaboration. The agreement is designed to transition superconducting technology from custom development programs to repeatable wafer manufacturing.

Nordson Test & Inspection to Unveil SonoFlex Acoustic Inspection System at SEMICON West 2026

09/21/2026 | Nordson Test & Inspection
Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence™ Ecosystem at SEMICON West 2026, October 13–15, in Booth 5844 at the Moscone Center in San Francisco, California.
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