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NovaCentrix Hires PIT Equipment Services for East Coast Sales of PulseForge Tools
January 12, 2021 | NovaCentrixEstimated reading time: 1 minute
NovaCentrix, the industry’s leading provider of photonic curing tools, high-intensity, pulsed-light soldering solutions, and conductive inks enabling the development and production of next-generation printed electronic devices, has announced the appointment of Don Dennison as their manufacturers’ representative. PIT Equipment Services, LLC will represent NovaCentrix PulseForge® Soldering tools in Southeastern New York, New Jersey and Eastern Pennsylvania.
PIT started in 1988 with a mission to assist electronic assembly companies in the New York/New Jersey/Eastern Pennsylvania metropolitan area. The key to their long-term success is service and support of each product sold.
“We are excited to be part of this new game-changing approach to soldering,” stated Dennison. This technology provides solutions to many of the current challenges to the PCB assembly process. PIT has always been part of new developments within the industry. “
NovaCentrix’ PulseForge® Soldering tools reflow off-the-shelf solders including SAC305 in seconds on low-temperature, flexible substrates such as paper and plastic. PulseForge Soldering tools enable new types of products in applications like consumer electronics, automotive and medical wearables. Product innovators and manufacturers can utilize flexible, low-cost substrates and deliver functionality not possible when using conventional ovens and lasers.
“We are already working closely with Don to introduce this new soldering capability to customers facing advanced manufacturing challenges,” said Stan Farnsworth, Chief Marketing Officer at NovaCentrix.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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