Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
IPC Promotes Sydney Xiao to President of Asia Operations
January 12, 2021 | IPCEstimated reading time: 1 minute
Effective January 1, 2021, IPC has promoted Sydney Xiao to president of Asia Operations. Xiao succeeds Philip Carmichael, who served as president of IPC’s Asia Operations from July 2015 to his retirement in December 2020.
In her new role, Xiao will lead IPC’s globalization initiative to expand the association’s member, standards, education and advocacy support to Greater China, Japan, Korea, Thailand and Vietnam. In addition, she will lead the organization’s Asian operations and staff and will lead strategy development and execution. She will remain at IPC’s China office in Shanghai.
Most recently, Xiao served as vice president of Asia Pacific Operations, overseeing the marketing, customer service, member success, finance, human resources and IT teams and working alongside Carmichael, supported IPC’s member service expansion in Japan, Korea and Southeast Asia. Prior to her vice president position, Xiao served as finance director, IPC Asia Pacific Operations and has been with IPC full time since 2012.
“Sydney is well versed in all aspects of IPC’s business, its products, services, and offerings,” said John Mitchell, IPC president and CEO. “For the past few years, Sydney has worked alongside Phil Carmichael charting a course for success for IPC in Asia. Successes include growth in membership and standards and training participation. We look forward to Sydney’s leadership in expanding IPC’s services further into Asia.”
Xiao has a master’s degree in International Business Administration from Tongji University in Shanghai and a bachelor’s degree in Accounting from Shanghai University.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.