Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
VEXOS Selects MIRTEC as 3D AOI ‘Partner of Choice’
January 12, 2021 | MirtecEstimated reading time: 2 minutes
MIRTEC is pleased to announce that VEXOS has selected MIRTEC as their 3D AOI ‘Partner of Choice’ based on key performance indicators including Inspection Performance, Gage R$&R, Ease of Programming and Customer Support.
“VEXOS is an award-winning global electronics manufacturing services (EMS) company providing complete supply chain management solutions for OEMs and new emerging technology companies. We continue to invest in new technology that will add value to our business and allow us to keep up with industry trends toward increased PCB density and miniaturization of electronics packaging,” stated Brian Morrison, vice president of Engineering.
“VEXOS recently performed an extensive evaluation with three top 3D AOI manufacturers based on key performance indicators including: Inspection Performance, Gage R&R, Ease of Programming and Operation, and Customer Support. We selected MIRTEC as our 3D AOI ‘Partner of Choice’ for our manufacturing facilities in both Markham, ON and LaGrange, OH. Our MV-7 OMNI 3D AOI machines provide exceptional performance and extremely consistent defect detection with minimal programming time. My team and I are equally impressed with MIRTEC’s Customer Support which has been second to none.”
“We at MIRTEC are committed to continuous improvement through innovation and strong quality leadership. Ours is a business of precision and accuracy, reproducibility and specificity, timeliness and trust. These are the real products and services which we provide to our valued customers,” said Brian D’Amico, president of MIRTEC’s North American Sales and Service Division. “With manufacturing facilities in LaGrange, Ohio, Markham, Ontario, Dongguan, China and Ho Chi Minh City, Vietnam; VEXOS is recognized throughout the world for having the Highest Quality Standards and an unwavering commitment to Customer Satisfaction. As such, the company is extremely selective in purchasing equipment that will add value to their business and provide them with a much-needed competitive edge. In MIRTEC they have found a partner that offers the most Technologically Advanced 3D Inspection Systems supported by a truly outstanding Global Support Network. We at MIRTEC are very proud to have been selected by VEXOS as their 3D AOI ‘Partner of Choice’. We look forward to a long and prosperous relationship between our two organizations.”
MIRTEC’s Award-Winning MV-7 OMNI 3D AOI Machines are configured with the company’s exclusive OMNI-VISION® 3D Inspection Technology which combines a 15 Mega Pixel CoaXPress Camera System with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D Technology to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured the MV-7 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.
For further information about MIRTEC’s Market Leading Inspection Solutions, please visit www.mirtec.com.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.