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EVS Introduces New Large Pot Solder Recovery System with Sealed Cabinet
January 13, 2021 | EVS InternationalEstimated reading time: 1 minute
EVS International, the leader in solder recovery, introduces the new EVS18KLF solder recovery system. The EVS 18KLF has a larger 18kilo/40lbs pot, allowing customers to recover more dross and producing a faster ROI. Users can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross.
EVS has continually improved the performance of the EVS units and the new EVS 18KLF is no exception. The solder recovery system has a touchscreen display, and like all EVS systems, is totally automatic.
EVS’ new patented technology provides a clean ingot bar as it filters the solder through gauze and the recovery rate is very high, achieving up to 80 percent solder from the dross.
The EVS 18KLF features a totally sealed cabinet, enclosing the dross bucket and fume extraction. This area is now totally sealed.
The revolutionary Tilting Pot Mechanism allows engineers to dispense with the space-consuming twin opposed air rams and door. Inverting and rotating dross/solder pot and a novel hot air-activated auto drain tap creates the solder ingots.
The simple but ruggedly designed unit is highly ISO14001 compatible as it lives by the ISO mantra of reduce – reuse – recycle, enabling customers to reduce solder consumption by up to 50+ percent, an unheard of savings in the electronics production industry.
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Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.