Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
DENSO, Aeva Collaborate to Bring FMCW 4D LiDAR to Mass Vehicle Market
January 19, 2021 | Business WireEstimated reading time: 1 minute
Aeva Inc., a leader in next generation sensing and perception systems, has announced a collaboration with DENSO, a leading global mobility supplier of advanced automotive technology for major automakers, to bring Aeva’s 4D LiDAR technology to the mass vehicle market.
Aeva’s 4D LiDAR technology is the only viable Frequency Modulated Continuous Wave (FMCW) technology to enable automated driving for series production. Built from the ground up on proprietary silicon photonics technology, Aeva’s 4D LiDAR combines instant velocity measurement for each pixel, long range at high resolution, immunity to other LiDAR or sunlight interference, and scalability at industry leading costs on proven semiconductor processes.
“DENSO is a leader in commercializing advanced technologies at affordable costs and our collaboration is further evidence that Aeva’s 4D LiDAR provides what we believe will be an unparalleled combination of superior performance and scalability,” said Soroush Salehian, Co-Founder and CEO at Aeva. “We’re excited to work alongside DENSO to bring Aeva’s 4D LiDAR to global OEMs looking to implement automated driving across their vehicle programs at scale.”
“Aeva’s FMCW 4D LiDAR solution addresses the missing link for perception in automated driving and advanced driver-assistance systems, with its unique ability to meet the stringent automotive performance and safety requirements,” said Kazuma Natsume, Director of AD & ADAS Engineering Div. 2 at DENSO. “We look forward to collaborating with Aeva to further develop FMCW LiDAR, bring it to the mass market and create a society free from traffic accidents.”
Aeva is engaged with 30 of the top OEM and automotive industry players in the advanced driver assistance and autonomous driving industries, has received strategic investments from Porsche SE, the majority shareholder of VW Group, and has relationships with some of the largest Tier 1 automotive suppliers.
Aeva remains on track to complete its previously announced business combination agreement with InterPrivate Acquisition Corp, a publicly traded special purpose acquisition company, in the first quarter of 2021. The business combination is expected to provide up to $563M in gross proceeds. The combined company is expected to be listed on the New York Stock Exchange under the ticker symbol, “AEVA”.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.