-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Nano Dimension Appoints Dr. Eli David to Board of Directors
January 20, 2021 | Nano Dimension Ltd.Estimated reading time: 1 minute

Nano Dimension Ltd., an industry leading additively manufactured electronics (AME)/ printed electronics (PE) provider, has announced the appointment of Dr. Eli David to the Board of Directors.
Dr. Eli David is a world renowned AI expert specializing in deep learning and evolutionary computation with over fifty papers published in leading artificial intelligence journals and conferences, mostly focusing on applications of deep learning and genetic algorithms in various real-world domains. For the past fifteen years, he has been teaching courses on deep learning and evolutionary computation, in addition to supervising the research of graduate students in these fields. He has also served in numerous capacities, successfully designing, implementing, and leading deep learning-based projects in real-world environments.
Dr. David also serves as an AI consultant to several Fortune 500 companies, and major venture capital and private equity firms. He is a frequently invited speaker in prominent AI venues, and a member of Forbes Technology Council.
Dr. David received the Best Paper Award in the 2008 Genetic and Evolutionary Computation Conference, the Gold Award in the prestigious “Humies” Awards for Human-Competitive Results in 2014, and the Best Paper Award in the 2016 International Conference on Artificial Neural Networks. He is the developer of Falcon, a Grandmaster-level chess playing program based on genetic algorithms and deep learning, which reached second place in the World Computer Chess Championship.
Yoav Stern, CEO of Nano Dimension, commented, “I am thrilled to have Dr. David join our Board of Directors. As a leading global thought leader in AI and a member of the Forbes Technology Council, his expertise and global business connections will be invaluable as we develop an advanced AI application in machine learning. I look forward to Dr. David’s input towards our next generation 3D-AME technology, which is envisioned to evolve into a network of fabrication and assembly systems of Hi-PEDs™ (High Performance Electronic Devices). We foresee a neural-network like array of machines, connected wirelessly and building a massive amount of cloud-residence fabrication process and materials data, sharing it for cross-machine performance improvements well as ERP and production management.”
Dr. David, stated, “I am confident that Nano Dimension will benefit from employing advanced AI and specifically neural networks for dramatically improving and optimizing its fabrication processes, and I hope my expertise in these fields as well as my global business and scientific network will prove beneficial to the Company.”
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.