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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Seika Machinery Launches Sawa Multi-Purpose Cleaning System
January 20, 2021 | Seika Machinery, Inc.Estimated reading time: Less than a minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the SC-BP3 Multi-Purpose Bubbling Cleaning System. The system cleans tough and stubborn flux five times faster than immersion cleaning.
The easy-to-use system uses an air valve in place of electricity. Combined with bubbling technology, the SC-BP3 delivers high cleaning power for various applications. The bubble washer features a tank large enough to clean 10 pallets simultaneously. It removes flux by simply soaking the parts.
The bubble washing system includes rinse and drying units, for cleansing ? rinse ? drying within 20 to 30 minutes. The Sawa Pica solvent is safe and odor-free with no flame point while being both sustainable and eco-friendly. The cleaner also can be used with other low-VOC and water-based cleaning solutions.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.