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Flex Appoints Michael Hartung as President, Chief Commercial Officer

07/26/2024 | Flex
Flex announced the appointment of Michael Hartung as President, Chief Commercial Officer, effective immediately. In his expanded role, Mr. Hartung will continue to report to Flex CEO, Revathi Advaithi and lead both the Agility and Reliability segments, focusing on delivering on the long-term Flex Forward strategy and driving the adoption of the company's end-to-end services and products across targeted markets.

Building Resilient Supply Chains

07/08/2024 | Mark Goodwin, Ventec International Group
Globalization and offshoring have shaped the supply chains of large manufacturing businesses for the past three to four decades. The main goal has been the relentless pursuit of cost control to minimize expenditure and outlay and thus maximize returns and profitability.

Reorganization of the ASMPT SMT Solutions Segment in North and South America

06/04/2024 | ASMPT
ASMPT, the market and innovation leader in hardware and software for semiconductor and electronics manufacturing, has reorganized its ASMPT SMT Solutions segment in the Americas (USA, Canada, Mexico and Brazil).

Flex Strengthens Reverse Logistics and Circular Economy Services with Acquisition of FreeFlow

06/03/2024 | Flex
Flex announced it has acquired FreeFlow, a company serving global secondary markets with asset disposition and digital circular economy tracking and reporting capabilities.

Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC

05/21/2024 | Real Time with...IPC APEX EXPO
Devan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.
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