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ExcelTech Invests in YESTECH FX-940 3D ULTRA AOI
February 4, 2021 | YESTECHEstimated reading time: Less than a minute
YESTECH, part of Nordson ELECTRONICS SOLUTIONS, is pleased to announce that ExcelTech, Inc. has purchased an FX-940 3D ULTRA AOI In-line PCB inspection system. The sale was liaised by Mike Gunderson of MaRC Technologies. ExcelTech is a Portland Metro area Electronic Manufacturing Services (EMS) company, serving a broad range of dynamic hi-tech industries, since 1976.
ExcelTech continually answers the complex needs and demanding timeframes of OEMs with reliability, flexibility and solid customer service. Matt Redhead, President of ExcelTech commented, “We earn our customers’ trust through reliable service and communication. The investment we made in the YESTECH 3D AOI system is proving to be extremely valuable as we strive to provide our customers the best possible quality at the best price. Partnering with YESTECH will position us to better serve our current and future customers in this very competitive market.”
With YESTECH’s advanced 3D imaging technology, ExcelTech has the capability to perform high-speed PCB inspection with exceptional defect coverage. Utilizing proprietary 3D technology and advanced inspection algorithms, the FX-940 ULTRA verifies correct assembly for parts and solder joints, thus enabling users to improve quality, increase throughput and reduce costs.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.