-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ExcelTech Invests in YESTECH FX-940 3D ULTRA AOI
February 4, 2021 | YESTECHEstimated reading time: Less than a minute
YESTECH, part of Nordson ELECTRONICS SOLUTIONS, is pleased to announce that ExcelTech, Inc. has purchased an FX-940 3D ULTRA AOI In-line PCB inspection system. The sale was liaised by Mike Gunderson of MaRC Technologies. ExcelTech is a Portland Metro area Electronic Manufacturing Services (EMS) company, serving a broad range of dynamic hi-tech industries, since 1976.
ExcelTech continually answers the complex needs and demanding timeframes of OEMs with reliability, flexibility and solid customer service. Matt Redhead, President of ExcelTech commented, “We earn our customers’ trust through reliable service and communication. The investment we made in the YESTECH 3D AOI system is proving to be extremely valuable as we strive to provide our customers the best possible quality at the best price. Partnering with YESTECH will position us to better serve our current and future customers in this very competitive market.”
With YESTECH’s advanced 3D imaging technology, ExcelTech has the capability to perform high-speed PCB inspection with exceptional defect coverage. Utilizing proprietary 3D technology and advanced inspection algorithms, the FX-940 ULTRA verifies correct assembly for parts and solder joints, thus enabling users to improve quality, increase throughput and reduce costs.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.