Nolan’s Notes: Looking Deep Into the Future With X-ray
Knocking Down the Bone Pile: Basics of Component Lead Tinning
Standard of Excellence: Anticipating Customer Needs Early and Often
Best Papers from SMTA International Announced
February 5, 2021 | SMTAEstimated reading time: 1 minute
The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Richard Coyle, Ph.D., Nokia Bell Labs, won the Best of Proceedings category for the paper "Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony." Co-authors include Charmaine Johnson, Dave Hillman, and Tim Pearson, Collins Aerospace; Michael Osterman, CALCE; Joe Smetana, Nokia; Keith Howell, Nihon Superior Co., Ltd.; Hongwen Zhang and Ji Geng, Indium Corp.; Julie Silk, Keysight Technologies; Derek Daily, Senju Comtek Corp.; Babak Arfaei, SUNY-Binghamton; Ranjit Pandher, Alpha Technologies; Andre Delhaise, Celestica; Stuart Longgood, Delphi Technologies; Andre Kleyner, Aptiv.
The following papers received honorable mention:
- Andrew Mawer, NXP Semiconductors, for the paper "Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications." Co-authors include Mollie Benson, Dwight Daniels, A R Nazmus Sakib, and Vishrudh Sriramprasad, NXP Semiconductors N.V.
- Jennifer Bennet, P.E., IBM Corporation, for the paper "CBGA and CCGA Field Reliability Predictions Confirmed." Co-authors include Jim Bielick and Marie Cole, IBM Corporation.
- Karen Tellefsen, Ph.D., MacDermid Alpha Electronics Solutions, for the paper "Advanced SIR Testing for Trapped Solder Paste Flux Residue." Co-authors include Aurkie Ray, Anna Lifton and Paul Salerno, MacDermid Alpha Electronics Solutions.
- Keith Sweatman, Ph.D., Nihon Superior Company, Ltd., for the paper "Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy." Co-authors include Tetsuro Nishimura, Nihon Superior Co., Ltd.; Sergey A. Belyakov and Christopher M. Gourlay, Imperial College London.
The authors will receive their awards during a ceremony at SMTA International 2021. The SMTA International Conference and Exhibition (SMTAI) 2021 will be held November 1-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN, USA. Details on participating in the 2021 SMTA International Conference are posted on the event website: https://smta.org/mpage/smtai-cfa2021
Abstracts of all papers can be browsed directly in the online Knowledge Base. Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but free PDF downloads are available only to SMTA members. Non-members can easily join SMTA for real-time access to the Knowledge Base.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
04/03/2025 | Real Time with...IPC APEX EXPOMichael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.