-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Best Papers from SMTA International Announced
February 5, 2021 | SMTAEstimated reading time: 1 minute

The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Richard Coyle, Ph.D., Nokia Bell Labs, won the Best of Proceedings category for the paper "Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony." Co-authors include Charmaine Johnson, Dave Hillman, and Tim Pearson, Collins Aerospace; Michael Osterman, CALCE; Joe Smetana, Nokia; Keith Howell, Nihon Superior Co., Ltd.; Hongwen Zhang and Ji Geng, Indium Corp.; Julie Silk, Keysight Technologies; Derek Daily, Senju Comtek Corp.; Babak Arfaei, SUNY-Binghamton; Ranjit Pandher, Alpha Technologies; Andre Delhaise, Celestica; Stuart Longgood, Delphi Technologies; Andre Kleyner, Aptiv.
The following papers received honorable mention:
- Andrew Mawer, NXP Semiconductors, for the paper "Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications." Co-authors include Mollie Benson, Dwight Daniels, A R Nazmus Sakib, and Vishrudh Sriramprasad, NXP Semiconductors N.V.
- Jennifer Bennet, P.E., IBM Corporation, for the paper "CBGA and CCGA Field Reliability Predictions Confirmed." Co-authors include Jim Bielick and Marie Cole, IBM Corporation.
- Karen Tellefsen, Ph.D., MacDermid Alpha Electronics Solutions, for the paper "Advanced SIR Testing for Trapped Solder Paste Flux Residue." Co-authors include Aurkie Ray, Anna Lifton and Paul Salerno, MacDermid Alpha Electronics Solutions.
- Keith Sweatman, Ph.D., Nihon Superior Company, Ltd., for the paper "Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy." Co-authors include Tetsuro Nishimura, Nihon Superior Co., Ltd.; Sergey A. Belyakov and Christopher M. Gourlay, Imperial College London.
The authors will receive their awards during a ceremony at SMTA International 2021. The SMTA International Conference and Exhibition (SMTAI) 2021 will be held November 1-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN, USA. Details on participating in the 2021 SMTA International Conference are posted on the event website: https://smta.org/mpage/smtai-cfa2021
Abstracts of all papers can be browsed directly in the online Knowledge Base. Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but free PDF downloads are available only to SMTA members. Non-members can easily join SMTA for real-time access to the Knowledge Base.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.