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Circuit Technology Center Installs Second Hentec/RPS Robotic Hot Solder Dip Machine
February 10, 2021 | Circuit Technology CenterEstimated reading time: Less than a minute
Hentec Industries/RPS Automation is pleased to announce that Circuit Technology Center has installed its second Hentec/RPS Odyssey 1325 robotic hot solder dip machine. The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.
“Hentec Industries is an instrumental partner to Circuit Technology Center as we continue the expansion of our BGA re-balling and component tinning services department to support our high reliability and defense industry customer base”, said Jeff Ferry, President of Circuit Technology Center. “We have now purchased multiple systems from Hentec, and they have been terrific to work with, implementing a variety of custom options to their standard Odyssey 1325 RHSD platform to suit our specific requirements. Customer support from upper management to their field service department has been top notch.”
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