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PCBASupplies Becomes Exclusive Supplier for Thermaltronics Solder Robots
February 15, 2021 | PCBASupplies.comEstimated reading time: 1 minute
PCBASupplies.com is pleased to announce that it is now the exclusive distributor of the Thermaltronics soldering robots. Thermaltronics’ award-winning lineup is now available exclusively from PCBASupplies in Texas, Oklahoma, Arkansas and Louisiana.
The single-head TMT-R8000S Solder Robot System is designed for simplified soldering applications but still includes vision/mapping, fiducial marks and dynamic laser height control, and incorporates the same IP software used on the company’s successful benchtop system. It also includes a separate drive motor, which allows for adjustment solder wire feeder, a feature under patent application.
The TMT-R9900S functions as an inline or stand-alone production system and is equipped with full vision to verify the procedure being undertaken and does not simply follow a pre-determined program. In this respect it has an observation mode, a verification mode and as a result – a decision making capability.
This equipment is autonomously capable of collecting and utilizing data for production processing, which is one of the most important factors necessary to meet the requirements of Industry 4.0 standards.
All Thermaltronics products are produced in accordance with ISO 9000 & ISO 14000 standards and meet either TUV, GS, CE or NRTL safety requirements. Strict quality control procedures are in place and product warranties are among the best in the industry.
PCBASupplies is a supplier of Printed Circuit Board Assembly (PCBA) and final assembly products. The company aims to provide unique, hard to find, or new to market supplies for electronic manufacturing.
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.