Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
PIT Equipment Services Represents XDry Humidity Controlled Cabinets on the East Coast
February 19, 2021 | XDry Corp.Estimated reading time: Less than a minute
XDry Corp., a leading supplier of humidity-controlled storage cabinets for manufacturing, laboratories and preservation, has announced an exclusive representative agreement with PIT Equipment Services, LLC on the east coast. Don Dennison of PIT will represent XDry humidity-controlled storage cabinets in Southeastern New York, New Jersey and Eastern Pennsylvania.
PIT started in 1988 with a mission to assist electronic assembly companies in the New York / New Jersey / Eastern Pennsylvania metropolitan area. The key to their long-term success is service and support of each product sold.
“With more than 30 years of experience in the electronics field, we look forward to working together and increasing the XDry market share in the New York metro area,” stated Don Dennison.
XDry has been providing humidity-controlled storage cabinets for more than 15 years. The storage systems are self-contained and easy to maintain. With XDry, there is no need for nitrogen or compressed air – just plug the cabinet into the wall and it is ready to go.
XDry’s cabinet environment can be maintained from ambient to 1% RH, providing constant and stable storage at precisely the required RH level. XDry storage cabinets satisfy standards such as IPC/JEDEC J-STD-033 and IPC/JEDEC J-STD-020.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.