It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
North American Semiconductor Equipment Industry Posts $3B Billings in January 2021
February 23, 2021 | SEMIEstimated reading time: Less than a minute
North America-based manufacturers of semiconductor equipment posted $3.04 billion in billings worldwide in January 2021 (three-month average basis), the first time monthly billings have reached $3 billion, according to the January Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 13.4 percent higher than the final December 2020 billings of $2.68 billion and is 29.9 percent higher than the January 2020 billings level of $2.34 billion.
“January billings of North America-based semiconductor equipment manufacturers marked a historic monthly high for the industry and a great start to the year,” said Ajit Manocha, SEMI president and CEO. “The acceleration of digital transformation is fueling strong, durable demand for semiconductor equipment.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
SASinno Americas Strengthens Field Service Capabilities with Addition of Oscar Ortiz González in Mexico
10/10/2025 | SASinno AmericasSASinno Americas is proud to announce the addition of Oscar Ortiz González as Senior Field Service Engineer, based in Mexico.
RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution
10/07/2025 | Agileo AutomationAgileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance.
Nordson Electronics Solutions Enables Seamless Integration of Actnano PFAS-Free Coatings With Asymtek Select Coat Conformal Coating Systems
09/23/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, announces full compatibility of its industry-leading ASYMTEK conformal coating systems with actnano’s next-generation, PFAS-free materials.
Henger Showcases Breakthrough Plasma Technology at 2025 THECA Show
09/22/2025 | HengerThe 2025 Thailand Electronic Circuit Asia Exhibition (THECA Show) was successfully convened from August 20 to 22 at the Bangkok International Trade & Exhibition Centre (BITEC). Zhuhai Henger Microelectronic Equipment Co., Ltd. delivered a particularly notable presentation at this exhibition, comprehensively demonstrating the company's latest advancements in the field of high-end plasma equipment.
T-Tech, Inc. Unveils the 5 Axis Quick Mill
09/19/2025 | T-TechT-Tech, Inc., a global leader in Rapid Prototyping Equipment, is excited to announces the launch of its latest innovation, the 5 Axis Quick Mill ™.