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Juki to Introduce New iCube HighFlex During APEX
February 23, 2021 | Juki Automation Systems (JAS), Inc.Estimated reading time: 2 minutes
Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and subsidiary of Juki Corporation, will exhibit during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Juki will showcase the new iCube HighFlex, RS-1R Placement Machine/RS-1XL, G-Titan Automated Screen Printer, JM-20/JM-100 Insertion Machine featuring an active clinching unit, and Autonomous Material Handling System.
The new iCube HighFlex offers the same complete “all-in-one” package that the original iCube offers. All existing features and options are available on the newest selective solder machine. New options also are available to help with ease of maintenance and overall machine use.
The new fluxer cleaner allows for dramatically reduced maintenance of the fluxer head. Using a special cleaning fluid, any flux residues and other contamination is dissolved and automatically cleaned from the flux head at a user defined interval.
The RS-1R features the Takumi head, a dynamic height, 8 nozzle placement head that automatically adjusts pick-and-placement height on-the-fly to optimize speed while offering a high degree of flexibility. The RS-1R also features RFID nozzles to be able to track the performance of each individual nozzle by serial number. With the new PG-01 offline teach camera and line optimization JaNets/NPI Plus software, the RS-1R provides easy data entry for faster programming.
The G-Titan screen printer is equipped with industry-leading “standard” features that empower customers with the highest quality printing solution, a path to Industry 4.0, and “Lights-Out-Manufacturing” with its award-winning specifications. The printer features a new interface with a modern look and many standard features, including touchscreen LCD, stencil inspection, solder paste rolling measurement, stencil lock, support block crash prevention and automatic solder paste dispense (500g jar).
The JM-100 odd-form inserter features the new “Takumi head” and has 8 nozzles equipped with a height-adjusting laser to optimize speed and can handle a wide range of components while maximizing speed. The system features a new active clinching unit that supports turn-in, turn-off and N-bend to prevent components from lifting during the reflow process.
Juki’s new Autonomous Material Handling System, building on their highly popular Intelligent Storage Systems, consists of the ISM3600 Ultra Flex Intelligent Storage System, the ISM3900 Ultra Flex expansion module, the Multi Interface Module, the External Elevator Module and an Autonomous Intelligent Vehicle (AIV) designed to work as one unit. The complete package provides the unique ability to automatically store, retrieve, deliver and return components throughout the factory. The systems also can be integrated with an X-ray component counter. Components can be taken by the AIV from the main warehouse to the storage tower and any other location where they are needed.
Additionally, Juki will showcase its Cube and iCube batch and inline selective soldering machines, Incoming Material Station (IMS) designed to automate the incoming materials process and, PMAXII and P-Primo Large Board Screen Printer.
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Nolan’s Notes: A Tribute to Iola—and Automation
12/02/2025 | Nolan Johnson -- Column: Nolan's NotesIn the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving the economy of the cities of Beaverton, Tigard, and Hillsboro. The only employer larger than Tektronix was the state of Oregon itself; virtually every Portlander had some connection to Tek.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
11/26/2025 | Nash Bell -- Column: Knocking Down the Bone PileSolderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.
Indium Experts to Present on Power Electronics at productronica 2025
11/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.