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Juki to Introduce New iCube HighFlex During APEX
February 23, 2021 | Juki Automation Systems (JAS), Inc.Estimated reading time: 2 minutes
Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and subsidiary of Juki Corporation, will exhibit during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Juki will showcase the new iCube HighFlex, RS-1R Placement Machine/RS-1XL, G-Titan Automated Screen Printer, JM-20/JM-100 Insertion Machine featuring an active clinching unit, and Autonomous Material Handling System.
The new iCube HighFlex offers the same complete “all-in-one” package that the original iCube offers. All existing features and options are available on the newest selective solder machine. New options also are available to help with ease of maintenance and overall machine use.
The new fluxer cleaner allows for dramatically reduced maintenance of the fluxer head. Using a special cleaning fluid, any flux residues and other contamination is dissolved and automatically cleaned from the flux head at a user defined interval.
The RS-1R features the Takumi head, a dynamic height, 8 nozzle placement head that automatically adjusts pick-and-placement height on-the-fly to optimize speed while offering a high degree of flexibility. The RS-1R also features RFID nozzles to be able to track the performance of each individual nozzle by serial number. With the new PG-01 offline teach camera and line optimization JaNets/NPI Plus software, the RS-1R provides easy data entry for faster programming.
The G-Titan screen printer is equipped with industry-leading “standard” features that empower customers with the highest quality printing solution, a path to Industry 4.0, and “Lights-Out-Manufacturing” with its award-winning specifications. The printer features a new interface with a modern look and many standard features, including touchscreen LCD, stencil inspection, solder paste rolling measurement, stencil lock, support block crash prevention and automatic solder paste dispense (500g jar).
The JM-100 odd-form inserter features the new “Takumi head” and has 8 nozzles equipped with a height-adjusting laser to optimize speed and can handle a wide range of components while maximizing speed. The system features a new active clinching unit that supports turn-in, turn-off and N-bend to prevent components from lifting during the reflow process.
Juki’s new Autonomous Material Handling System, building on their highly popular Intelligent Storage Systems, consists of the ISM3600 Ultra Flex Intelligent Storage System, the ISM3900 Ultra Flex expansion module, the Multi Interface Module, the External Elevator Module and an Autonomous Intelligent Vehicle (AIV) designed to work as one unit. The complete package provides the unique ability to automatically store, retrieve, deliver and return components throughout the factory. The systems also can be integrated with an X-ray component counter. Components can be taken by the AIV from the main warehouse to the storage tower and any other location where they are needed.
Additionally, Juki will showcase its Cube and iCube batch and inline selective soldering machines, Incoming Material Station (IMS) designed to automate the incoming materials process and, PMAXII and P-Primo Large Board Screen Printer.
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Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
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Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.