-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Best Technical Paper at IPC APEX EXPO 2021 Selected
February 25, 2021 | IPCEstimated reading time: 1 minute
The best technical conference paper of IPC APEX EXPO 2021 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will be recognized during show opening remarks on Tuesday, March 9.
Taking top honors, the winning paper is, “Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction” by Sarah Czaplewski, IBM Corporation. Her co-authors were: Roger Krabbenhoft and Junyang Tang, IBM Corporation. This paper will be presented during Technical Conference Session 14 (BF5-PCB Design - HDI and Signal Integrity Considerations) on Thursday, March 11.
This year, two papers were selected in the honorable mention category. Honorable mention goes to, “Board Thickness Effect on Accelerated Thermal Cycle Reliability” by Joe Smetana, Nokia. His co-authors included: Richard Coyle, Nokia; Eric Lundeen, BAE Systems; Iulia Muntele, Sanmina; Scott Danko, TTM; Neil Hubble, Akrometrix; and Bev Christian, HDPUG. This paper will be presented during Technical Conference Session 9 EE3 (HDP Projects Progress) on Wednesday, March 10.
Honorable mention also goes to “Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague” by Hailey Jordan, The Charles Stark Draper Laboratory, Inc. Her co-authors were: Wade Goldman and Curtis Leonard, The Charles Stark Draper Laboratory, Inc. This paper will be presented during Technical Conference Session 3 EE1 (PCBA Quality, Reliability, and AI-based Inspection) on Wednesday, March 10.
The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place, including professional development courses, online exhibition, keynote presentations, networking activities and more, visit www.IPCAPEXEXPO.org.
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
11/22/2024 | Dan Feinberg, I-Connect007In my first article of this special series, I wrote a synopsis of the IPC Raymond E. Pritchard Hall of Fame (HOF) Award, along with a commentary on its first few members, particularly Pritchard. Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded this high honor and recognition. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Patty Goldman.
Winners of IPC Hand Soldering World Championship at electronica 2024 Announced
11/21/2024 | IPCIPC hosted its Hand Soldering World Championship in Munich, Germany, at electronica on 14-15 November 2024, welcoming 14 competitors from 13 companies and 12 countries worldwide. Skilled contestants competed to build an electronics assembly in accordance with IPC-A-610 Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process and overall product quality. The contestants were allowed a maximum of 60 minutes to complete the assembly.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
Enjoy the Journey: PCB Design Instructor Kris Moyer on His Sustainable Lifestyle
11/19/2024 | Michelle Te, IPC CommunityWhen I contacted IPC design instructor Kris Moyer to discuss his sustainable lifestyle, he responded to my text with a call. "I'm calling you from about 8,000 feet, sitting at the foot of Mammoth Lakes," he told me. “My friends and I are about to get in the pool for the afternoon." Kris can do this because he actually lives full-time in his travel-trailer at this campground. He's now a permanent camper, taking him anywhere the winds blow—and where there's strong internet service—so he can teach his PCB design classes, offer expert interviews, and live off the land.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.