The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Ventec, BizLink, Footprintku Announce Strategic Alliance
February 26, 2021 | VentecEstimated reading time: 1 minute
Ventec is pleased to announce that it has entered into a global strategic alliance with leading interconnect solutions provider, BizLink Holding Inc., and Footprintku Inc., an online EDA library and digital transformation services provider for electronic components. This alliance is formed to provide a solution that boosts product development process efficiency and shortens development and time-to-market.
BizLink has long been a supplier of key components to the IT industry, including connectors and cables. The company is experienced in new product introduction (NPI) as well as in system integration, manufacturing, and in assembly.
BizLink’s Chairman, Roger Liang, said, "For the design of electronic products, the trend is for thinner, lighter, and aesthetically pleasing products whilst maintaining functionality and compatibility. This has prompted the demand for rapid and frequent updates of components and product styles. The ability to quickly develop products to respond to market changes has become the key to success."
Ventec International’s Chairman, Tony Lau, pointed out, "What the market needs is a platform that integrates the advantages of upstream components, mid-section design, and back-end manufacturing. The creation of such a platform, we knew, would greatly help accelerate industrial innovation." Footprintku Inc.’s Chairman, YC Hwang, continued, "In response, we propose a cloud platform using the exclusive AI and digital transformation technology of Footprintku.com to integrate the resources of all three companies. The result is a one-stop service, making it possible for product developers to quickly and efficiently find the best components and quality suppliers for their product R&D and design change stages."
This alliance is built upon Footprintku’s cloud database for electronic components as well as BizLink’s solutions and Ventec International’s materials. It integrates the capabilities of new product introduction (NPI), design services (ODM), and manufacturing assembly (EMS). This alliance will reduce the cost of and time in searching for electronic components for product developers. Furthermore, it will accelerate product evolution and facilitate industrial innovation by connecting highly flexible and customized electronic industry supply chain partners.
The alliance was officially announced at a press conference held at the Grand Hyatt Taipei on February 26, 2021.
Share on:
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.