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Vitronics Soltec Introduces Closed Loop PPM Control System for Centurion Reflow Soldering Oven
March 2, 2021 | ITW EAEEstimated reading time: 1 minute
ITW EAE has announced a new Closed Loop PPM Control System for the Vitronics Soltec Centurion™ Reflow Oven. The closed loop PPM control system is designed to be used in a nitrogen environment with CATHOX™ to maintain a precise PPM setpoint range. The closed loop system can maintain the setting from 200PPM to 2000PPM at +/-100PPM tolerance from 200 to 500 and 20% tolerance from 500 to 2000. In Production Mode, the system ensures stable PCB quality. In Idle Mode, it reduces nitrogen consumption and automatically recovers to PPM setpoint before the machine returns to production.
The patented CATHOX™ (Catalytic Thermal Oxidizer) dramatically reduces maintenance requirements while keeping a clean process environment. It is very effective in removing volatile compounds from the process tunnel during reflow. In thermal oxidation, organic vapors are converted to hydrocarbons, which are captured by a filter. Centurion’s design also ensures that when maintenance is required, you have easy access and can do the maintenance job with few tools required.
“The Centurion Reflow Oven has built a reputation for superior quality and innovation,” said Coco Zhang, Reflow Soldering Product Manager. “The new closed loop PPM control system will benefit our customers by ensuring consistent solder quality even in high-mix production lines and changing throughputs.”
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.