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New WPI from KIC Brings Complete Process Monitoring, Process Control and Traceability to the Wave Solder Process
March 2, 2021 | KICEstimated reading time: 1 minute
KIC, a market and technology leader in profiling and process monitoring, announces the release of the WPI – Wave Process Inspection System. The WPI system is the latest in KIC’s innovative line of products, and brings complete process monitoring, process control and traceability to the wave solder process.
KIC is well-known as the market leader in solutions and technologies for reflow soldering process management, has the most robust and flexible connectivity capabilities when addressing manufacturing requirements for Reflow Process Inspection. Now, KIC’s new WPI brings its award-winning technology and thermal experience to the wave solder process by providing users with automatic profiling – including an industry first Dwell Time and Parallelism measurement for each production board – real-time preheat and wave analytics, automatic SPC charting and more.
Tom Bergeron - Product Manager, KIC, stated: “This new game changing development for wave soldering, real-time production dwell time for every assembly, along with all of the critical profile data, was a huge challenge for us. But once again KIC, and our amazing R&D team, comes up with another industry first. We continue to be the innovators in all thermal process areas, providing the best solutions for our customers.”
Move toward the future of Smart Factory integration with Wave Process Inspection, gaining line connectivity, flexible production, traceability, data analytics, process transparency/control, and real-time insight. For more information about KIC, visit www.kicthermal.com.
KIC is a technology company working to make reflow ovens smarter through thermal profiling automation and optimization solutions. With offices across the globe, KIC is ready to become your partner in oven-based manufacturing. Corporate headquarters are located at 16120 W Bernardo Dr., San Diego, CA 92127. https://kicthermal.com.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.