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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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New WPI from KIC Brings Complete Process Monitoring, Process Control and Traceability to the Wave Solder Process
March 2, 2021 | KICEstimated reading time: 1 minute
KIC, a market and technology leader in profiling and process monitoring, announces the release of the WPI – Wave Process Inspection System. The WPI system is the latest in KIC’s innovative line of products, and brings complete process monitoring, process control and traceability to the wave solder process.
KIC is well-known as the market leader in solutions and technologies for reflow soldering process management, has the most robust and flexible connectivity capabilities when addressing manufacturing requirements for Reflow Process Inspection. Now, KIC’s new WPI brings its award-winning technology and thermal experience to the wave solder process by providing users with automatic profiling – including an industry first Dwell Time and Parallelism measurement for each production board – real-time preheat and wave analytics, automatic SPC charting and more.
Tom Bergeron - Product Manager, KIC, stated: “This new game changing development for wave soldering, real-time production dwell time for every assembly, along with all of the critical profile data, was a huge challenge for us. But once again KIC, and our amazing R&D team, comes up with another industry first. We continue to be the innovators in all thermal process areas, providing the best solutions for our customers.”
Move toward the future of Smart Factory integration with Wave Process Inspection, gaining line connectivity, flexible production, traceability, data analytics, process transparency/control, and real-time insight. For more information about KIC, visit www.kicthermal.com.
KIC is a technology company working to make reflow ovens smarter through thermal profiling automation and optimization solutions. With offices across the globe, KIC is ready to become your partner in oven-based manufacturing. Corporate headquarters are located at 16120 W Bernardo Dr., San Diego, CA 92127. https://kicthermal.com.
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Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.