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IPC Presents Wide-Ranging Policy Priorities to Biden Administration
March 4, 2021 | IPCEstimated reading time: 1 minute
In a letter to U.S. President Joe Biden, IPC applauds the Biden administration’s early directions on manufacturing policy and maps a detailed policy agenda to drive growth and resilience in electronics manufacturing.
“Your call for a resurgence in U.S. manufacturing signals a federal commitment that is sorely needed and long overdue,” wrote IPC President and CEO John Mitchell. “The U.S. Government needs to move beyond rhetorical support and provide meaningful and tangible programs that collectively constitute a coordinated, bipartisan vision for the future of manufacturing.”
The letter outlines policy recommendations in five key areas, including:
1. Strengthen the defense electronics industrial base.
a. Implement Section 841 of the FY21 National Defense Authorization Act, which will bolster the security and resiliency of the U.S. defense electronics supply chain.
b. Address concerns with the government’s Cybersecurity Maturity Model Certification (CMMC).
2. Develop and implement a strategy to promote the factories of the future.
a. Establish an interagency manufacturing policy lead.
b. Invest in R&D for the entire electronics ecosystem.
c. Bring back the U.S. supply chain.
3. Expand and upskill the workforce.
a. Support industry-recognized worker credentials.
b. Reduce the burden for apprenticeship program implementation.
4. Rebuild trade relationships.
a. Revive multilateral trade pacts and dispute-resolution bodies.
b. Endorse and implement a North American Manufacturing Initiative.
5. Protect human health and the environment via practical policies and regulations.
a. Structure regulations to build on industry best practices.
b. Work with industry to ensure policies and regulations are based on existing data and information.
“IPC works with industry to ‘Build Electronics Better,’” Mitchell writes. “Your administration aims for the U.S. to ‘Build Back Better.’ Our shared language suggests we have a shared vision of creating skilled, well-paying jobs in a cleaner economy that renews and extends U.S. leadership in electronics manufacturing.”
View the full letter here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
Kris Moyer Discusses His Emerging Design Technologies Class
09/04/2025 | Marcy LaRont, I-Connect007Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
NOTE Appoints Bahare Mackinovski Chief Sales and Marketing Officer
09/04/2025 | NOTEAs part of NOTE’s strategic focus on growth and customer value, the company is now strengthening its executive management team by appointing Bahare Mackinovski as Chief Sales and Marketing Officer.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.