-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Averatek Corporation Launches the A-SAP 'Community of Interest'
March 4, 2021 | AveratekEstimated reading time: 1 minute

Averatek Corporation has launched the A-SAP™ Community of Interest. This web-based content platform was developed as a central resource for the industry: so that all members of the supply chain—from designers to end user—can exchange information and insights about the A-SAP™ leading-edge PCB fabrication process.
“The ability to form 15-micron feature sizes with Averatek A-SAP™ technology is proven,” said Tara Dunn, vice president of marketing and business development for Averatek. “Now we are building a community of experts who understand how to apply this benefit to PCB design and fabrication: to optimize the advantages of these tight feature sizes and reset the technology curve.”
“The electronics industry is at an inflection point,” said Haris Basit, CEO of Averatek. “The A-SAP™ process opens up high-density design opportunities, with RF and signal integrity benefits that were previously unavailable. Three commercial fabricators are implementing A-SAP™ technology now, and PCB designers can collaborate with these innovators to meet their customer needs. Next-generation design is here today.”
Averatek A-SAP™ is an advanced manufacturing process for printed circuit board fabrication, with trace and space widths as narrow as 15 microns. This process can dramatically reduce area, layer count and weight of electronics systems - as well as provide significant RF benefits. A-SAP™ can be easily integrated with traditional PCB manufacturing equipment and materials.
About Averatek
Averatek Corporation develops and licenses advanced manufacturing technology for a variety of electronic products, including very-high density printed circuit boards, semiconductor packaging and RF and millimeter wave passive components. In addition, Averatek produces the key chemistry that enables these advanced manufacturing processes. For more information, visit www.averatek.com.
Suggested Items
TT Electronics Secures £20 Million in Aerospace and Defence Contracts as European Programmes Accelerate
06/06/2025 | TT ElectronicsTT Electronics has been awarded more than £20 million in new and renewed defence contracts, marking a major step forward in its contribution to Europe’s rapidly evolving defence landscape.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
Essemtec USA Welcomes Frank Hart as Head of Sales for North America
06/05/2025 | Essemtec USAEssemtec USA is proud to announce the appointment of Frank Hart as Head of Sales for North America, effective immediately. With over 30 years of experience in the SMT industry, Frank brings a wealth of knowledge, leadership, and a strong track record of success to our team.
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,
New Era Electronics Establishes U.S. Presence with New Salt Lake City Operation
06/04/2025 | PRNewswireNew Era Electronics, a leading provider of high-performance industrial computing solutions, announces the establishment of its first United States location in Salt Lake City, Utah. This strategic expansion to the U.S. underscores New Era Electronics' commitment to enhancing supply chain continuity and delivering exceptional services across North America.