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Real Time With… Premium Sponsors Share ‘Top 5 Things You Need to Know’
March 5, 2021 | I-Connect007Estimated reading time: Less than a minute
As part of I-Connect007’s coverage of the IPC APEX EXPO 2021, four premium sponsors shared their knowledge and expertise. Each company is well-known and respected for the work it is doing to advance and maintain a high standard in the industry. The premium sponsors—Taiyo America, Burkle North America, Super Dry, and Blackfox—each share five important things you need to know about their sector of the industry.
I-Connect007 has a mission as an industry leader to create and share content that is both practical and thought-provoking. We hope you enjoy these features, and stay tuned for I-Connect007’s extensive coverage of the IPC APEX EXPO, March 8-12.
To access the Top Five Things You Need to Know, please click on the links below:
Taiyo America: Solder Masks
Burkle North America: Direct Imaging
Super Dry: Moisture Management
Blackfox: Manufacturing Training
“The Top Five Things You Need to Know” are short, informative tips that will bring clarity and efficiency to your organization.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.