The Marketing Minute: If Your Marketing Budget Gets Cut in Half, Then What?
Punching Out: How Are the Big Boys in Electronics Doing?
It’s Only Common Sense: Complexity Is the Enemy of Profit
Sonim Partners with FIH Mobile for Next Generation Rugged Feature Phones
March 5, 2021 | PRNewswireEstimated reading time: 1 minute
Sonim Technologies, Inc., has announced the selection of FIH Mobile, a subsidiary of Foxconn Technology Group, to support the engineering and manufacturing of Sonim's next generation feature phones. These future devices are expected to leverage QUALCOMM chipsets and feature the unique characteristics that have built Sonim's reputation for the most rugged mobile phones available.
"We selected FIH for this important partnership due to its globally recognized comprehensive cell phone design, development and production capabilities, which will enable us to accelerate the deployment of our highest volume devices in a cost-efficient way," said Tom Wilkinson, Chief Executive Officer. "Additionally, by selecting FIH, Sonim's next generation of feature phone devices will be made at facilities in Vietnam and leverage FIH's unique experience in rugged device manufacturing and working with all US Carriers."
Sonim expects to benefit from FIH's integrated ODM services, including hardware, software, certification and manufacturing. Additionally, working with FIH will provide Sonim access to a best-in-class supply chain and manufacturing process. The first devices are expected to come to market in the third quarter of 2021.
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Cirtronics Brings Commercialization Discussion to Robotics Summit & Expo 2026
05/14/2026 | CirtronicsCirtronics, a leading electronics contract manufacturer specializing in complex robotics systems, will sponsor and lead a featured panel discussion at the 2026 Robotics Summit & Expo, taking place May 27–28 at the Thomas M. Menino Convention & Exhibition Center in Boston.
Nortech Systems Reports Q1 Results
05/14/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical imaging, medical device, industrial, and aerospace & defense markets, reported financial results for the first quarter ended March 31, 2026.
Top Business Groups Urge Congress to Extend, Expand Successful Semiconductor Tax Credit
05/14/2026 | SIAThe Semiconductor Industry Association (SIA) and a broad coalition of 17 other top business and trade groups in a letter urged Congress to extend the Advanced Manufacturing Investment Credit (AMIC) – a highly impactful tax credit for chip production that is set to expire at the end of this year – and expand it to cover semiconductor design and other critical R&D activities.
ONERugged Accelerates Smart Manufacturing with Rugged Computing Solutions
05/14/2026 | BUSINESS WIREAs global manufacturing continues its rapid digital transformation, enterprises are facing increasing pressure to improve production efficiency, strengthen quality control, and enable real-time operational visibility.
Absolute EMS Expands Support for LEO, MEO, and GEO Satellite Programs
05/13/2026 | Absolute EMS, Inc.Absolute EMS, Inc., a Silicon Valley–based provider of high-technology electronics manufacturing services, continues to grow its presence in the satellite sector, supporting programs across low Earth orbit (LEO), medium Earth orbit (MEO), and geostationary orbit (GEO) with advanced PCBA manufacturing, test, and sub-assembly capabilities.