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Advanced Electronics Packaging Digest

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Suggested Items

LITEON Announces Strategic Investment in Liquid Cooling Technology Company DCX

09/03/2026 | BUSINESS WIRE
LITEON Technology announced a strategic investment in DCX POLSKA Sp. z o.o., a Warsaw, Poland-based provider of advanced liquid cooling systems for AI and High-Performance Computing (HPC) data centers.

Real Time with... THECA 2026: Polar Instruments Expands Testing and CAM Capabilities

09/03/2026 | Real Time with... THECA
Amit Bhardwaj, managing director of Polar Instruments (Asia Pacific), discusses the company's evolution from a long-standing UK subsidiary into an independent regional business, with expanded CAM offerings and IST technology that can substantially reduce test time. Mr. Bhardwaj explains how these capabilities support critical applications and the continued growth of electronics manufacturing across the Asia Pacific.

QTREX Quantum AME Technology Deployed by Major Israeli Defense Company

09/02/2026 | Globe Newswire
The agreement includes exclusivity provisions that underscore the strategic importance the partner places on QTREX's technology.

Cadence PCIe 6.0 Subsystem Achieves First-Pass Compliance

09/02/2026 | Cadence Design Systems
Cadence announced that its PHY and controller IP for the PCI Express® (PCIe®) 6.0 specification, implemented in the TSMC N3 process, achieved first-pass success at the recent PCI-SIG® compliance workshop held in late July.

Teledyne Surpasses 1,000 Space Imaging Sensors with NASA Roman Telescope Launch

09/01/2026 | BUSINESS WIRE
Teledyne Space Imaging, a leading supplier of space-qualified imaging sensors, focal plane arrays, and integrated camera systems, celebrated a major milestone following the successful launch of NASA's Nancy Grace Roman Space Telescope, which lifted off on August 30 aboard a SpaceX Falcon Heavy rocket from Kennedy Space Center in Florida.
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