Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Amtech Announces Record New Orders for Advanced Reflow Systems
March 12, 2021 | Amtech Systems, Inc.Estimated reading time: 1 minute
Amtech Systems, Inc., a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power devices, analog and discrete devices, electronic assemblies and light-emitting diodes (LEDs), announced strong order momentum for its PYRAMAX™ reflow systems sold into advanced packaging applications.
The new orders were from several customers and included multi-unit follow-on orders from leading multi-national advanced packaging OSATs in the Asia Pacific region. These orders include PYRAMAX TrueFlat™ convection reflow ovens used to eliminate warpage for very thin substrates in advanced packaging applications.
“We continue to see strong bookings with an increase in activity from strategic accounts globally, especially from key Asian advanced packaging companies,” said Michael Whang, Chief Executive Officer of Amtech. “Customer need drove the development of the Pyramax TrueFlat system, and we continue to work with key customers to add new capabilities to the TrueFlat system that will expand its use in the marketplace,” added Mr. Whang.
The PYRAMAX family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. The Pyramax features an exclusive closed loop convection control and process temperatures up to 400°C. For the most demanding applications, PYRAMAX can provide O2 levels as low as 2ppm above source in the peak reflow zone. The PYRAMAX TrueFlat is designed for very thin substrates of 0.15mm to 0.30mm, ensuring flatness throughout the heating and cooling process – eliminating die tilt.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.