-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
GOEPEL electronic Launches New AOI Software Version with Enhanced 3D Capabilities
March 12, 2021 | GOEPEL ElectronicEstimated reading time: 1 minute
Users of AOI and SPI systems from GOEPEL electronic can look forward to a software update. With the rollout, the system software PILOT AOI in the new version 6.5 will receive numerous smaller and larger improvements for test functions, program creation and optimizations.
A new function for 3D inspection at THT solder joints significantly increases the measurement accuracy at pins with the possibility of presetting the position as well as the minimum and maximum length of the pin. Similarly, measurements can be performed on pin solder joints, with minimum and maximum solder height and wetting preset. The THT test functions are integrated into the fully automatic test program creation with MagicClick. As a further feature, the measured value recordings are optimized by reducing possible interference, among other things.
As a second major innovation, a 3D inspection of unpopulated PCB areas has been integrated into PILOT AOI version 6.5. This inspects for defects such as solder beads, solder splashes, lost and superfluous components. The defect detection is based on height differences. Interfering influences on the measurements, e.g. reflections on the PCB material or position imprints, therefore have no effect on the measurement results.
A new history with comparison function provides a better overview of changes to test programmes. This provides a version history with the option of restoring older project versions. The user can clearly and at a glance record the differences between two revisions. This provides detailed information about the user, workstation and software version.
The new PILOT software version 6.5 is available for all 3D AOI and SPI system versions, both for SMD and THT inspection.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.