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Saki Corporation Boosts AOI Capabilities with Its New Z-Axis Solution
March 15, 2021 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has introduced enhancements to the 3Di Series AOI system with its new Z-axis solution to accelerate inspection of tall components, press-fit components and PCBAs in jigs.
The new Z-axis package for 3Di Series achieves a maximum height-measurement range in 3D mode to 40mm. The maximum focus height in 2D is also increased to 40mm.
With these capabilities, the 3Di Series solutions can inspect low-profile components and refocus on the identification and polarity markings of tall components such as large electrolytic capacitors. The composite image enables accurate defect detection and optical character recognition (OCR), ensuring superior quality assurance.
The boost to 3D performance enables accurate height measurement when inspecting the pins of press-fit connectors, which are increasingly used in various applications including automotive, consumer, and industrial today. Conventional AOI systems with limited Z-axis range can fail to identify defects such as bent pins and incorrect alignment or coplanarity. With advanced algorithms including edge searching and plane detection built-in, Saki’s 3Di Series Z-axis enhancement ensures high inspection accuracy and repeatability.
“The new Z-axis package greatly enhances value for customers by further increasing accuracy driven by the technology of combining images in the height direction,” said Yoshihiro Akiyama, CTO at Saki Corporation. “Our 3Di inspection machine series continues to offer the best capabilities in the industry, ready to handle the latest manufacturing trends including press-fit inspection challenges.”
For further information on the 3Di Series and new Z-axis package, visit www.sakicorp.com/en/.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and X-ray inspection and measurement systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
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