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March 2021 Issue of PCB007 Magazine Available Now
March 15, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

In this issue of PCB007 Magazine, we begin to map out the new landscape of transportation electronics—with the lay of the land evolving before our very eyes. Transportation applications will be an active area of innovation in the coming years, as development continues in miniaturization, power management, environmental robustness and infrastructure. This innovation will change PCBs throughout the entire industry. So strap in while we explore PCBs in transportation.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
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Rachael Temple - AlltematedSuggested Items
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.
Get the ‘Hole Truth’ in New June Issue of PCB007 Magazine
06/16/2025 | I-Connect007 Editorial TeamIn "The Hole Truth," the new June 2025 issue of PCB007 Magazine explores what it takes to build the “perfect” via—and how to ensure its reliability from the start. Featuring insights from Mike Carano, Stefan Rung, Giovanni Obino, and Happy Holden, this issue is packed with expert takes on advanced inspection, precision drilling (yes, we’re talking pico lasers), and whether it’s time to rethink the cross-section.
Würth Elektronik and HKSTP Sign New Engineering Service Program
06/05/2025 | Wurth ElektronikWürth Elektronik and the Hong Kong Science and Technology Parks Corporation (HKSTP) have signed a comprehensive cooperation agreement to promote development and production in Hong Kong. Around 100 start-ups and Small and Midsized Enterprizes (SMEs) in the field of microelectronics, as well as Hong Kong's entire production ecosystem, will benefit from local development support, knowledge transfer, and partner network of the well-known component manufacturer.
IIT Kharagpur, A*STAR Singapore Forge Strategic Partnership to Advance Semiconductor Innovation in Asia
06/03/2025 | IIT KharagpurIn a landmark move to foster global collaboration in semiconductor research and talent development, IIT Kharagpur has signed a Memorandum of Understanding (MoU) with the Institute of Microelectronics (IME) under Singapore’s Agency for Science, Technology and Research (A*STAR).