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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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March 2021 Issue of PCB007 Magazine Available Now
March 15, 2021 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
In this issue of PCB007 Magazine, we begin to map out the new landscape of transportation electronics—with the lay of the land evolving before our very eyes. Transportation applications will be an active area of innovation in the coming years, as development continues in miniaturization, power management, environmental robustness and infrastructure. This innovation will change PCBs throughout the entire industry. So strap in while we explore PCBs in transportation.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
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Sweeney Ng - CEE PCBSuggested Items
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
SPEA Expands Global Footprint with New Hub in Santa Clara, Silicon Valley
05/08/2026 | SPEASPEA has officially landed in the heart of Silicon Valley, with the grand opening of its newest facility in Santa Clara, California.
IBM, Aramco Explore Collaboration to Accelerate AI and Innovation Across Saudi Arabia
05/07/2026 | IBMAramco and IBM announced their intended collaboration on opportunities to advance artificial intelligence, agentic AI, automation, material science and other mutually agreed domains in the industrial sector.
Dan’s Biz Bookshelf: ‘Abundance: How We Build a Better Future’
05/07/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfEvery once in a while, a book comes along that doesn’t just make you think, it makes you sit up straighter and ask: Why aren’t we doing this better? "Abundance" is exactly that kind of book. When so much of our national conversation revolves around scarcity—housing, energy, infrastructure, and opportunity—authors Ezra Klein and Derek Thompson flip the script. They argue, persuasively and intelligently, that America’s real problem isn’t a lack of ideas. It’s a lack of execution.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.