-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
March 2021 Issue of PCB007 Magazine Available Now
March 15, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

In this issue of PCB007 Magazine, we begin to map out the new landscape of transportation electronics—with the lay of the land evolving before our very eyes. Transportation applications will be an active area of innovation in the coming years, as development continues in miniaturization, power management, environmental robustness and infrastructure. This innovation will change PCBs throughout the entire industry. So strap in while we explore PCBs in transportation.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
Suggested Items
Würth Elektronik and HKSTP Sign New Engineering Service Program
06/05/2025 | Wurth ElektronikWürth Elektronik and the Hong Kong Science and Technology Parks Corporation (HKSTP) have signed a comprehensive cooperation agreement to promote development and production in Hong Kong. Around 100 start-ups and Small and Midsized Enterprizes (SMEs) in the field of microelectronics, as well as Hong Kong's entire production ecosystem, will benefit from local development support, knowledge transfer, and partner network of the well-known component manufacturer.
IIT Kharagpur, A*STAR Singapore Forge Strategic Partnership to Advance Semiconductor Innovation in Asia
06/03/2025 | IIT KharagpurIn a landmark move to foster global collaboration in semiconductor research and talent development, IIT Kharagpur has signed a Memorandum of Understanding (MoU) with the Institute of Microelectronics (IME) under Singapore’s Agency for Science, Technology and Research (A*STAR).
Strategic Materials Conference 2025 Spotlights Materials Innovation to Advance Semiconductor Manufacturing
06/02/2025 | SEMIWith materials innovation at the core of next-generation semiconductor technologies, the Strategic Materials Conference (SMC) 2025 brings together top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest trends and advancements.
Stephen Winchell Appointed DARPA Director
06/02/2025 | DARPAStephen Winchell was sworn in today as the 24th director of the Defense Advanced Research Projects Agency.
The French Oil Mill Machinery Company Celebrates 125 Years of Innovation and Manufacturing Leadership
05/28/2025 | The French Oil Mill Machinery CompanyThe French Oil Mill Machinery Company marked its 125th anniversary this week, celebrating a rare legacy of continuous family ownership and manufacturing innovation.