Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
EIPC Webinar Focuses on 5G
March 15, 2021 | EIPCEstimated reading time: 1 minute
In line with the growing adoption of 5G, there is a clear demand in the whole PCB supply chain on finding solutions to decrease signal losses at the PCB level. The understanding of loss savings in signalling at the PCB level is meaningful from functionality, but also from the signal point of view and the total power consumption of the product.
Thus, OEMs are challenging the supply chain to find the solutions to increase signal losses and improve the signal quality at the PCB level.
In line with this, the sixth Technical Snapshot Webinar of the European Institute for the PCB Community (EIPC) will focus on 5G. To be held on March 17, the session will feature interesting papers on the dielectric material, copper foil, and testing solutions, supporting the challenge of signal losses driven by these high-speed products.
The webinar will feature Dipl.-Ing. Manfred Huschka, vice president of global marketing, AGC Multi Material General Division, who will present his paper, "Electrical and Mechanical Reliability of an RF Laminate are Key Requirements For Selection in 77 GHz ADAS sensor"; Julie Mouzon of Circuitfoil, who will present a paper on ultra-flat ED-copper foils dedicated to high-speed digital and RF circuit boards; and Martyn Gaudion of Polar Instruments, who will speak on the primary drivers for insertion loss on high speed base material.
Moderated by Paul Waldner of Multiline International Europa, EIPC’s webinar will also have a Q&A session at the end.
For more information, visit www.eipc.org.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.