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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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EIPC Webinar Focuses on 5G
March 15, 2021 | EIPCEstimated reading time: 1 minute

In line with the growing adoption of 5G, there is a clear demand in the whole PCB supply chain on finding solutions to decrease signal losses at the PCB level. The understanding of loss savings in signalling at the PCB level is meaningful from functionality, but also from the signal point of view and the total power consumption of the product.
Thus, OEMs are challenging the supply chain to find the solutions to increase signal losses and improve the signal quality at the PCB level.
In line with this, the sixth Technical Snapshot Webinar of the European Institute for the PCB Community (EIPC) will focus on 5G. To be held on March 17, the session will feature interesting papers on the dielectric material, copper foil, and testing solutions, supporting the challenge of signal losses driven by these high-speed products.
The webinar will feature Dipl.-Ing. Manfred Huschka, vice president of global marketing, AGC Multi Material General Division, who will present his paper, "Electrical and Mechanical Reliability of an RF Laminate are Key Requirements For Selection in 77 GHz ADAS sensor"; Julie Mouzon of Circuitfoil, who will present a paper on ultra-flat ED-copper foils dedicated to high-speed digital and RF circuit boards; and Martyn Gaudion of Polar Instruments, who will speak on the primary drivers for insertion loss on high speed base material.
Moderated by Paul Waldner of Multiline International Europa, EIPC’s webinar will also have a Q&A session at the end.
For more information, visit www.eipc.org.
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.