-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Experienced Sales Team Represents Hentec/RPS in Mexico
March 18, 2021 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that all regions of Mexico have professional sales and support by Torenko & Associates and TechSystems International. Eric Baker, Don Carius and Jorge Godinez of TechSystems International provide coverage of the Tijuana region as well as Southern California. Ron Torenko, Jorge Diaz, Julio Richards, and Cesar Acosta of Torenko & Associates provide coverage of the interior of Mexico as well as Texas, Oklahoma, Louisiana, and Arkansas.
Technical support and service of our growing customer base in Mexico is provided by Field Service Engineer Aaron Cantú. Aaron is a graduate of EDEC Universidad in Monterrey, Mexico. With his previous eight years of experience in selective soldering technology, and his continued knowledge of the electronics assembly industry, Aaron is a welcomed addition to the expanding selective soldering and lead tinning business of Hentec/RPS.
Suggested Items
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
SMTA Releases Final Batch of Training Resources Donated by Bob Willis
05/29/2025 | SMTAThe Surface Mount Technology Association (SMTA) announces the release of several more webinars, poster sets, and photo libraries to conclude a generous donation from renowned industry expert Bob Willis.
Altus Supports Phoenix Systems in Advancing THT Assembly with Robotic Soldering
05/27/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has successfully supported Phoenix Systems UK Ltd in its investment in robotic soldering technology to further enhance its through-hole technology (THT) assembly processes.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.