UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2
The Shaughnessy Report: A Handy Look at Rules of Thumb
Elementary, Mr. Watson A Designer's Dilemma—Metric or Imperial Units?
Ansys Receives TSMC OIP Ecosystem Forum Customers' Choice Award for 5G Millimeter Wave Chip Analysis Solution Paper
March 19, 2021 | PRNewswireEstimated reading time: 1 minute
Ansys received the Customers' Choice Award for a technical paper presented at TSMC 2020 North America Open Innovation Platform® (OIP) Ecosystem Forum. Within the paper, Ansys provided a roadmap for adding new technology to the Ansys® Totem™ RF design solution to address challenges in next-generation communication technologies beyond 5G, enabling customer success. The paper won the award based on the popular vote by conference attendees and can be downloaded on TSMC.com.
Transitioning to 5G millimeter wave wireless communication requires massive integration of RF components into digital SoCs (System-on-Chip). RF devices consume significant power and the resulting electromigration and self-heating challenges significantly impact the efficiency, cost and reliability of high-speed designs, which must be comprehensively addressed. Ansys enhanced Totem's capabilities to address the needs of 5G and high-speed RF designers.
Ansys' paper, titled "Electromigration and Self-Heat Analysis on RF Devices for mmWave Designs," details how Totem empowers 5G and high-speed RF designers to conduct electromigration and self-heat analysis. The Totem electromigration flow was demonstrated on an RF block using TSMC 16nm process technology and has been validated by TSMC.
"As a valued partner, Ansys provides leading design solutions that enable our mutual customers to take advantage of TSMC's latest process technologies," said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. "We are pleased to congratulate Ansys as the winner of this Customers' Choice Award and look forward to our continued collaboration with Ansys to address future complex challenges for designing next-generation silicon technologies."
"Together with TSMC, Ansys continues to help engineers overcome significant hurdles for designing 5G and high-speed RF chips," said John Lee, vice president and general manager at Ansys. "Receiving this prestigious award from TSMC for the second time in three years is a testament to the impact our industry-leading simulation solutions have made on the design community and we intend to deepen our collaboration with TSMC to solve more challenges in the near future."
Share on:
Suggested Items
iNEMI HDI Socket Warpage Prediction and Characterization Webinar
11/15/2024 | iNEMIHigh-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.
Keysight Providing Software to Enable Researchers through the Microelectronics Commons
11/15/2024 | Keysight TechnologiesKeysight Technologies, Inc. announced it has reached an agreement to provide its electronic design automation (EDA) software to six of the eight hubs participating in the Microelectronics Commons (Commons).
AST SpaceMobile Announces Launch Services Agreements to Enable Continuous Space-Based Cellular Broadband Service Coverage
11/15/2024 | BUSINESS WIREAST SpaceMobile, Inc., the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones, and designed for both commercial and government applications, announced launch services agreements securing the orbital launch capacity to enable continuous space-based cellular broadband service coverage across some of the most in-demand cellular markets globally.
NetVia Group Invests in KLA's Frontline InCAM Pro Software
11/14/2024 | EpecNetVia Group, a leading provider of advanced printed circuit boards (PCBs) and solutions for high-reliability industries, proudly announces its investment in and implementation of Frontline InCAM® Pro software.
Rules of Thumb: A Primer
11/14/2024 | Andy Shaughnessy, Design007 MagazineMany industry-wide rules of thumb are based on DFM constraints or formulas, but others are based on tribal knowledge. In this interview, Andy Shaughnessy sits down with our contributors Kris Moyer and Kelly Dack to discuss the role of rules of thumb, when to employ them, and when it’s time to do the math.