The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics 
Global Sourcing Spotlight: Evaluating a Supplier’s Capabilities
Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Ansys Receives TSMC OIP Ecosystem Forum Customers' Choice Award for 5G Millimeter Wave Chip Analysis Solution Paper
March 19, 2021 | PRNewswireEstimated reading time: 1 minute
Ansys received the Customers' Choice Award for a technical paper presented at TSMC 2020 North America Open Innovation Platform® (OIP) Ecosystem Forum. Within the paper, Ansys provided a roadmap for adding new technology to the Ansys® Totem™ RF design solution to address challenges in next-generation communication technologies beyond 5G, enabling customer success. The paper won the award based on the popular vote by conference attendees and can be downloaded on TSMC.com.
Transitioning to 5G millimeter wave wireless communication requires massive integration of RF components into digital SoCs (System-on-Chip). RF devices consume significant power and the resulting electromigration and self-heating challenges significantly impact the efficiency, cost and reliability of high-speed designs, which must be comprehensively addressed. Ansys enhanced Totem's capabilities to address the needs of 5G and high-speed RF designers.
Ansys' paper, titled "Electromigration and Self-Heat Analysis on RF Devices for mmWave Designs," details how Totem empowers 5G and high-speed RF designers to conduct electromigration and self-heat analysis. The Totem electromigration flow was demonstrated on an RF block using TSMC 16nm process technology and has been validated by TSMC.
"As a valued partner, Ansys provides leading design solutions that enable our mutual customers to take advantage of TSMC's latest process technologies," said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. "We are pleased to congratulate Ansys as the winner of this Customers' Choice Award and look forward to our continued collaboration with Ansys to address future complex challenges for designing next-generation silicon technologies."
"Together with TSMC, Ansys continues to help engineers overcome significant hurdles for designing 5G and high-speed RF chips," said John Lee, vice president and general manager at Ansys. "Receiving this prestigious award from TSMC for the second time in three years is a testament to the impact our industry-leading simulation solutions have made on the design community and we intend to deepen our collaboration with TSMC to solve more challenges in the near future."
Share on:
Suggested Items
Cadence AI Autorouter May Transform the Landscape
06/19/2025 | Andy Shaughnessy, Design007 MagazinePatrick Davis, product management director with Cadence Design Systems, discusses advancements in autorouting technology, including AI. He emphasizes a holistic approach that enhances placement and power distribution before routing. He points out that younger engineers seem more likely to embrace autorouting, while the veteran designers are still wary of giving up too much control. Will AI help autorouters finally gain industry-wide acceptance?
Beyond Design: The Metamorphosis of the PCB Router
06/18/2025 | Barry Olney -- Column: Beyond DesignThe traditional PCB design process is often time-consuming and labor-intensive. Routing a complex PCB layout can consume up to 30% of a designer’s time, and addressing this issue is not straightforward. We have all encountered this scenario: You spend hours setting the constraints and finally hit the Go button, only to be surprised by the lack of visual appeal and the obvious flaws in the result.
Robust AI Demand Drives 6% QoQ Growth in Revenue for Top 10 Global IC Design Companies in 1Q25
06/15/2025 | TrendForceTrendForce’s latest investigations reveal that 1Q25 revenue for the global IC design industry reached US$77.4 billion, marking a 6% QoQ increase and setting a new record high. This growth was fueled by early stocking ahead of new U.S. tariffs on electronics and the ongoing construction of AI data centers around the world, which sustained strong chip demand despite the traditional off-season.
Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
06/13/2025 | Cadence Design Systems, Inc.At NVIDIA GTC Paris, Cadence announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA.
Zuken Autorouters Embrace Collaborative AI
06/12/2025 | Andy Shaughnessy, Design007 MagazineMaybe you’ve never liked autorouters; if so, you’re not alone. As Andy Buja, Zuken’s technical account manager for PCB Solutions, admits, autorouters are not perfect. But today’s autorouters allow designers a greater level of control than ever before, especially routers that incorporate collaborative AI.