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Indium Corporation Welcomes 15 College Students to Award-Winning Summer Internship Program
July 24, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation, a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, is pleased to welcome 15 new interns into its award-winning summer internship program.
Since its inception in 2012, Indium Corporation’s internship program has been a launch pad for talented college students in materials science and related fields. Each intern is immersed in critical real-world work projects and programs that support company goals and business initiatives. At the conclusion of the program, they will have gained valuable insight into the technology industry, a network of professional contacts, and practical experience to build their resumes and expand their portfolios.
The following students are participating in Indium Corporation’s 2025 summer internship program at five company facilities throughout Central New York:
- Fred Beck, Metal Preform Research Intern
- Linda Zhao, Thermal Research Intern
- Elise Smith, R&D Solder Alloy Development Intern
- Lexy Morse, Operational Excellence Intern
- Kunika Samant, Manufacturing Quality Engineering Intern
- Jenna Orlando, Human Resources Intern
- Finn Holohan, Business Systems Analyst Intern
- Amy Nadeau, Sustainability Intern
- Kaitlyn Salce, Supply Chain Management Intern
- Frank Trevisani, Finance Innovation Intern
- Sydney Labayewski, Marketing Communications Intern
- Gabriella Carollo, Technical Support Intern
- Emin Skiljan, Application Engineering Intern
- Marcus Day, Materials Testing Intern
- David Soboyejo, Product Management Intern
“We’ve seen so many of our interns achieve great things, both during and after their internships, with many continuing their employment after the 10-week program,” said Indium Corporation Talent Specialist Maria Vacca, who first joined the company as a member of the summer 2020 intern class. “The summer internship program embodies the company’s guiding principle of The Indium Way—Respect, Appreciation, and Achievement—by giving these promising students the opportunity to develop skills and build experience in a dynamic STEM business environment.”
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Julia McCaffrey - NCAB GroupSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Indium Promotes Huang to Senior Manager, Marketing Communications
08/28/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing Communications, to continue to lead the company’s branding and promotional efforts.
Indium Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
08/26/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.