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BTU to Unveil New Selective Soldering System at NEPCON China
March 22, 2021 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has announced plans to exhibit at NEPCON China, scheduled to take place April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Center. BTU will showcase its new selective soldering system for the first time – the Hentec Industries Valence 3508. BTU recently announced the distribution agreement limited to Asia with Hentec Industries.
The Valence 3508 was designed for high mix, high volume, high level PCB production. The continuous duty, multi-station, in-line selective soldering machine utilizes an electromagnetic pump. The Valence 3508 can be programmed in minutes and is highly configurable and customizable. With a three-shift processing area and stainless-steel ball screws, the Valence 3508 selective soldering system increases production efficiency and reduces downtime associated with maintenance.
BTU is also featuring its award-winning Pyramax™ convection reflow oven at the show. BTU’s Pyramax family of high-throughput is widely recognized as the global standard of excellence for SMT solder reflow, semiconductor packaging and LED packaging and assembly. Pyramax reflow ovens provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry. With 6, 8, 10 and 12-zone air or nitrogen models, 350°C maximum temperature and a comprehensive menu of options, Pyramax™? reflow ovens are the industry’s most versatile performers and best value.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.