Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
CyberOptics’ SQ3000 Multi-Function System Showing at NEPCON China
March 22, 2021 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at NEPCON China, scheduled to take place April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Center. The company will showcase the SQ3000™ Multi-Function for AOI, SPI and CMM.
CyberOptics’ SQ3000 Multi-Function system can identify critical defects and measure critical parameters, providing a superior process control solution for effective yield management. In addition to AOI and SPI applications, highly accurate coordinate measurements can be attained faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours.
Powered by proprietary Multi-Reflection Suppression™ (MRS™) sensor technology, the 3D SQ3000 all-in-one system offers an unmatched combination of high speed, high resolution and high accuracy. The MRS sensor meticulously identifies and rejects reflections caused by shiny components making it an ideal technology solution for a wide range of applications with stringent requirements. The Ultra-High Resolution MRS sensor option delivers superior performance ideally suited for socket metrology, micro and mini LED, microelectronics and other applications where an even greater degree of accuracy and inspection reliability is critical.
The world’s first in-line CMM includes CyberCMM™, an extensive software suite for metrology grade measurements on all critical points. In addition, the latest 3D AOI software enables ultra-fast programming capabilities, auto tuning and enhancements that significantly speed setup, simplify the process, reduce training efforts and minimize operator interaction.
About CyberOptics
CyberOptics Corporation is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
For more information, visit www.cyberoptics.com.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.