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Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
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Absolute EMS Invests in High-End, Large Format Wave Solder System
March 23, 2021 | Absolute EMS, Inc.Estimated reading time: 1 minute
Absolute EMS, Inc., a leading provider of turnkey and consignment manufacturing services, has invested in a large format JAGUAR N450 high-end lead and lead-free wave soldering system.
David Godinez, Engineering Manager commented: “The decision to place the JAGUAR N450 in our newly enhanced large format 4.0 factory was simple. This machine offers complete flexibility, while being efficient, energy-saving and simple to operate with built-in safety features. Our customer verticals demand that we support lead and lead-free manufacturing. The JAGUAR has dual solder pots to accommodate both while running a smooth and quick transition from one product line to the next. It also offers large format capabilities up to 24” wide, which supports our customer needs.”
The JAGUAR N450 offers closed-loop control with an inverter control system to manage stability and accuracy of speed. Independent temperature control in four pre-heating zones with top and bottom heating elements ensures the best heat-efficiency. The double wave furnace can accommodate two boards simultaneously and adapts to various sizes. The built-in nitrogen system ensures smooth and shiny solder joints that adhere to IPC standards.
Additionally, the N450’s powerful software features printed circuit board (PCB) online temperature measurement. The easy to learn control software can be learned in just minutes.
A long-time commitment to sustainability contributes to Absolute EMS leading the way for efficient manufacturing operations among EMS organizations.
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.