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TopLine Awarded US Patent for CCGA Lead Free Solder Columns
March 29, 2021 | TopLineEstimated reading time: Less than a minute
TopLine Corporation, a provider of electronic components, services, and component engineering technology, has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.
TopLine has employed substantial engineering resources in recent years to develop novel approaches to manufacturability and reliability of CCGA components that are usable with Field Programmable Gate Arrays (FPGA) and Application-Specific Integrated Circuit (ASIC) Packages. CCGA packages are assembled with solder column terminations that reduce stress in harsh environments, stresses resulting from wide temperature swings when mounting materials having different coefficients of thermal expansion (CTE) onto Printed Circuit Boards (PCBs).
Martin Hart, CEO, stated, “Our unique lead-free solder column is designed with an inner copper core that prevents collapse of the semiconductor chip that also serves as a heat-sink to conduct heat from the underside of the CCGA package, resulting in enhanced reliability. The novel Pb-Free column structure conforms to RoHS directives that assure Restriction of Hazardous Substances in electrical and electronic equipment. We’re pleased to have been awarded this patent.”
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