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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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IPC Issues Call for Participation for IPC APEX EXPO 2022
April 8, 2021 | IPCEstimated reading time: 1 minute
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2022 to be held at the San Diego Convention Center. Professional development courses will take place January 23, 24 and 27, 2022 and the technical conference will take place January 25–27, 2022.
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper."
Expert papers and presentations are being sought in the following areas: factory of the future implementation; circuit design and component technologies; quality, reliability, test and inspection; enabling future technologies; meeting extreme environments; electronics materials; conscientious engineering; assembly processes; and PCB fabrication and materials. For specific topics under each area, visit www.ipcapexexpo.org/CFP.
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.
Technical conference paper abstracts are due June 18, 2021. Professional development course proposals are due July 16, 2021. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP.
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AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
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Micross, Sital Announce Global Manufacturing & Distribution Partnership
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Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024
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Nolan’s Notes: Coming to Terms With AI
05/07/2024 | Nolan Johnson -- Column: Nolan's NotesHow fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then I went to IPC APEX EXPO and upended it all. I originally had compared AI to drag racing in that (CPU) horsepower and new (data) vehicles have steadily delivered higher performance competition. That seemed pretty accurate given how generative AI models dominated the popular media with amazing results—and sometimes spectacular crashes.