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IPC Issues Call for Participation for IPC APEX EXPO 2022
April 8, 2021 | IPCEstimated reading time: 1 minute

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2022 to be held at the San Diego Convention Center. Professional development courses will take place January 23, 24 and 27, 2022 and the technical conference will take place January 25–27, 2022.
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper."
Expert papers and presentations are being sought in the following areas: factory of the future implementation; circuit design and component technologies; quality, reliability, test and inspection; enabling future technologies; meeting extreme environments; electronics materials; conscientious engineering; assembly processes; and PCB fabrication and materials. For specific topics under each area, visit www.ipcapexexpo.org/CFP.
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.
Technical conference paper abstracts are due June 18, 2021. Professional development course proposals are due July 16, 2021. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
Lessons From a Thousand Columns: Dan Beaulieu on Writing, Selling, and Staying the Course
08/21/2025 | Michelle Te, I-Connect007For 20 years, Dan Beaulieu has been a steady voice in sales and marketing, offering weekly columns that challenge, inspire, and guide professionals in the electronics industry and beyond. Soon, he will reach a remarkable milestone—his 1,000th It’s Only Common Sense weekly column. In this Q&A, we look behind the scenes of Dan’s writing journey, exploring what has kept him motivated, the lessons he’s learned along the way, and how two decades of weekly columns have shaped his career and the industry conversation.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.