-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
New Approach Brings Industry a Step Closer to Transparent Electronics
April 8, 2021 | FleetEstimated reading time: 3 minutes
A new study could pave the way to revolutionary, transparent electronics.
Such see-through devices could potentially be integrated in glass, in flexible displays and in smart contact lenses, bringing to life futuristic devices that seem like the product of science fiction.
For several decades, researchers have sought a new class of electronics based on semiconducting oxides, whose optical transparency could enable these fully-transparent electronics.
Oxide-based devices could also find use in power electronics and communication technology, reducing the carbon footprint of our utility networks.
A RMIT-led team has now introduced ultrathin beta-tellurite to the two-dimensional (2D) semiconducting material family, providing an answer to this decades-long search for a high mobility p-type oxide.
“This new, high-mobility p-type oxide fills a crucial gap in the materials spectrum to enable fast, transparent circuits,” says team leader Dr Torben Daeneke, who led the collaboration across three FLEET nodes.
Other key advantages of the long-sought-after oxide-based semiconductors are their stability in air, less-stringent purity requirements, low costs and easy deposition.
“In our advance, the missing link was finding the right, ‘positive’ approach,” says Torben.
Positivity Has Been Lacking
There are two types of semiconducting materials. ‘N-type’ materials have abundant negatively-charged electrons, while ‘p-type’ semiconductors possess plenty of positively-charged holes.
It’s the stacking together of complementary n-type and p-type materials that allows electronic devices such as diodes, rectifiers and logic circuits.
Modern life is critically reliant on these materials since they are the building blocks of every computer and smartphone.
A barrier to oxide devices has been that while many high-performance n-type oxides are known, there is a significant lack of high-quality p-type oxides.
Theory Prompts Action
However in 2018 a computational study revealed that beta-tellurite (?-TeO2) could be an attractive p-type oxide candidate, with tellurium’s peculiar place in the periodic table meaning it can behave as both a metal and a non-metal, providing its oxide with uniquely useful properties.
“This prediction encouraged our group at RMIT University to explore its properties and applications,” says Dr Torben Daeneke, who is a FLEET associate investigator.
Liquid Metal – Pathway to Explore 2D Materials
Dr Daeneke’s team demonstrated the isolation of beta-tellurite with a specifically developed synthesis technique that relies on liquid metal chemistry.
“A molten mixture of tellurium (Te) and selenium (Se) is prepared and allowed to roll over a surface,” explains co-first author Patjaree Aukarasereenont.
“Thanks to the oxygen in ambient air, the molten droplet naturally forms a thin surface oxide layer of beta-tellurite. As the liquid droplet is rolled over the surface, this oxide layer sticks to it, depositing atomically thin oxide sheets in its way.”
“The process is similar to drawing: you use a glass rod as a pen and the liquid metal is your ink,” explains Ms Aukarasereenont, who is a FLEET PhD student at RMIT.
While the desirable ?-phase of tellurite grows below 300 °C, pure tellurium has a high melting point, above 500 °C. Therefore, selenium was added to design an alloy that has a lower melting point, making the synthesis possible.
“The ultrathin sheets we obtained are just 1.5 nanometres thick – corresponding to only few atoms. The material was highly transparent across the visible spectrum, having a bandgap of 3.7 eV which means that they are essentially invisible to the human eye” explains co-author Dr Ali Zavabeti.
Assessing Beta-Tellurite: Up to 100 Times Faster
To assess the electronic properties of the developed materials, field-effect transistors (FETs) were fabricated.
“These devices showed characteristic p-type switching as well as a high hole mobility (roughly 140 cm2V-1s-1), showing that beta-tellurite is ten to one hundred times faster than existing p-type oxide semiconductors. The excellent on/off ratio (over 106) also attests the material is suitable for power efficient, fast devices” Ms Patjaree Aukarasereenont said.
“The findings close a crucial gap in the electronic material library,” Dr Ali Zavabeti said.
“Having a fast, transparent p-type semiconductor at our disposal has the potential to revolutionise transparent electronics, while also enabling better displays and improved energy-efficient devices.”
The team plans to further explore the potential of this novel semiconductor. “Our further investigations of this exciting material will explore integration in existing and next-generation consumer electronics,” says Dr Torben Daeneke.
Read the original article, here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Sealed for Survival: Potting Electronics for the Toughest Environments
10/29/2025 | Beth Massey, MacDermid Alpha Electronics SolutionsElectronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
10/28/2025 | Kurt Palmer -- Column: Driving InnovationRigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).