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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EIPC Technical Snapshot Webinar on Supply Chains
April 12, 2021 | EIPCEstimated reading time: 1 minute
The frailty of global supply chains has been clearly indicated of late. A gust of wind in Egypt, a zephyr of misfortune in China, a mistral of miscalculation at foundries in 2019, and suddenly the things you need now—are not there.
In the light of the current supply chain issues and material price pressures facing Europe, the EIPC (European Institute for the PCB Community) will be holding a webinar dedicated to the supply chain.
To be held on April 14, the webinar will feature presentations from Alun Morgan of Ventec; Francois Bottazzi of Circuit Foil; Andreas Folge of Nan Ya; and Dr. Bart Kuipers of Erasmus Centre for Urban, Port and Transport Economics.
The webinar will be followed by a Q&A session.
For more information or to register, visit www.eipc.org.
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Klaus Koziol - atgSuggested Items
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
STARTEAM GLOBAL Achieves A Score in CDP’s Supplier Engagement Assessment
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Zhen Ding Reports Record 1Q26 Revenue; Up 1.6% YoY
05/14/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million, with EPS of NT$1.33.
Lightium Selects Aras Innovator to Support Development of Photonic AI Chips
05/12/2026 | BUSINESS WIREAras, a leading provider of digital thread solutions for product lifecycle management (PLM) and engineering AI, announced that Lightium, a Switzerland-based startup specializing in photonic integrated circuits (PICs), has selected Aras Innovator® to establish a connected foundation for managing the complexity of its photonic chip development.
Green Circuits to Discuss Space-Ready Electronics Manufacturing to Space Tech Expo USA
05/12/2026 | Green CircuitsGreen Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, will exhibit at Space Tech Expo USA 2026, taking place June 2–4 in Anaheim.