Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
IWLPC Technical Committee Announces Best Papers Awards from 2020 Conference
April 14, 2021 | SMTAEstimated reading time: Less than a minute
The IWLPC Technical Committee is pleased to announce the Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee. Papers were evaluated based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
The Best 3D Track Paper was awarded to Max Min, Ph.D., Samsung Foundry, for “Accelerating Innovations in the New Era of HPC, 5G and Networking with Advanced 3D Packaging Technologies.”
The Best Wafer-Level Packaging (WLP) Track Paper went to Jae-Gwon Jang, Samsung, for "Advanced RDL Interposer PKG Technology for Heterogeneous Integration."
The Best Advanced Manufacturing and Test (AMT) Track Paper was awarded to Bryan Kasprowicz, Photronics, for the paper "Defect Printability for 2/2 RDL and the Impact of Advanced Reticle Processes.”
All papers from the conference proceedings are available in the SMTA Knowledge Base as well as the IEEE Xplore Digital Library.
Share on:
Suggested Items
China Overtakes Germany and Japan in Robot Density
11/22/2024 | IFRChina's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.