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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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IWLPC Technical Committee Announces Best Papers Awards from 2020 Conference
April 14, 2021 | SMTAEstimated reading time: Less than a minute
The IWLPC Technical Committee is pleased to announce the Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee. Papers were evaluated based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
The Best 3D Track Paper was awarded to Max Min, Ph.D., Samsung Foundry, for “Accelerating Innovations in the New Era of HPC, 5G and Networking with Advanced 3D Packaging Technologies.”
The Best Wafer-Level Packaging (WLP) Track Paper went to Jae-Gwon Jang, Samsung, for "Advanced RDL Interposer PKG Technology for Heterogeneous Integration."
The Best Advanced Manufacturing and Test (AMT) Track Paper was awarded to Bryan Kasprowicz, Photronics, for the paper "Defect Printability for 2/2 RDL and the Impact of Advanced Reticle Processes.”
All papers from the conference proceedings are available in the SMTA Knowledge Base as well as the IEEE Xplore Digital Library.
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Nortech Systems Unveils Reimagined Brand Identity
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