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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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New Desmear Line from TSK Schill GmbH in Operation at Hofstetter PCB AG
April 19, 2021 | TSK Schill GmbHEstimated reading time: Less than a minute

TSK supplies its long-standing and highly valued customer with a new horizontal chemical wet process machine.
TSK Schill GmbH continues to make progress in wet process machine engineering. Their long-time customer Hofstetter PCB AG in Switzerland invests in a new Desmear line, after the old line had now unfortunately become outdated. The exceptionally good cooperation between Hofstetter and TSK made the project a success, and now that commissioning has been completed, the customer is ready for the future.
"We are very proud to have implemented a very important project with the new Desmear line for Hofstetter PCB in this time and are looking forward to support also in future requests," says Sales Manager Marc Aicheler.
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Marcy’s Musings: From Pitch to PO—The Sales Stack
07/21/2025 | Marcy LaRont -- Column: Marcy's MusingsIt is a foundational truth that a company lives and dies by its sales. Receiving that PO or contract starts the operational chain. It is the purest symbol of the machinations of the business process: You are paying me for something I am doing, making, or sourcing for you. Then, every single thing a business does in executing and fulfilling that sales agreement speaks directly to customer experience and whether more POs will follow. You won't keep customers if you don't make a quality product and provide strong customer service.
July 2025 PCB007 Magazine: Sales—From Pitch to PO
07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
Tightening of LPDDR4X Supply Drives Up Prices; Smartphone Brands to Accelerate Adoption of LPDDR5X
07/17/2025 | TrendForceTrendForce’s latest investigations reveal that major Korean and U.S. memory suppliers are expected to significantly reduce or even cease production of LPDDR4X in 2025 and 2026.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.