-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
NovaCentrix's Rudy Ghosh, PhD, to Explore Photonic Soldering during Online SMTA Chapter Meeting
April 23, 2021 | NovaCentrixEstimated reading time: 2 minutes

NovaCentrix, the industry’s leading provider of photonic curing tools, conductive inks and the new PulseForge® Soldering high-intensity pulsed-light solution, is pleased to announce that Rudy Ghosh, PhD, will present during an online joint SMTA chapter meeting on Thursday May 13, 2021 from 1-2 p.m. PST.
The presentation will explore photonic soldering, which uses high intensity flash lamps as an alternative to laser soldering. This is a combined chapter meeting with the following 8 SMTA Chapters: Boston, Capitol, Central Texas-Austin, Heartland, Los Angeles/Orange County, Oregon, Puget Sound, Silicon Valley (San Jose).
Ghosh will present, “Use of flash lamps to achieve non-equilibrium soldering and assembly using conventional solder alloys.” The drive to enhance human interactivity and reduce weight of electronic systems has led to the use of non-conventional substrates. As the substrates become thinner, more flexible and economical, the thermal stability of the working substrate is significantly lowered. As such, the conventional modes of component attachment are no longer functional.
To bridge this gap, anisotropic adhesives and tapes, as well as low temperature solders and conductive epoxies, have been developed. However, in terms of performance, conventional soldering is still the champion. One way to combine traditional soldering techniques with thermally sensitive substrates is laser soldering. However, technical challenges, combined with the high costs of lasers, continue to create barriers to a broader adoption.
This discussion focuses on photonic soldering, which uses high intensity flash lamps to overcome the disadvantages of laser soldering; while still enabling soldering on a wide range of substrates. Similar to laser soldering, photonic soldering utilizes selective absorption of light to enable conventional solders to affix commercial packages on the underlying thermally unstable substrate.
As the Technical Program Lead at NovaCentrix, Ghosh helps translate technical innovations into customer ready products. He works closely with customers, technology partners, and collaborators to solve technical challenges and identify new avenues for the application of the technology for printed and flexible electronics. He works with the global business team to define and engage in commercial opportunities related to the technical program and furthers those areas of opportunity through industry outreach and engagement.
Previously, Ghosh was a Post-Doc at the Microelectronics Research Center at the University of Texas at Austin, where he led the Center’s research into the synthesis of 2D materials. He holds a PhD in Physics from the University of North Carolina at Chapel Hill and a MS in Physics from the Indian Institute of Technology, Bombay. He has authored over 30 publications in a variety of technical journals.
For more information or to register the event, click here.
Learn more about NovaCentrix’s products and services by visiting www.NovaCentrix.com.
About NovaCentrix
NovaCentrix partners with you to take products from inspiration to implementation. Through our innovative PulseForge® tools and Metalon® Inks products, we continue to enable advancements in printed electronics for researchers, product innovators, and manufacturers as technologies and markets evolve.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.