Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Micron Announces Leadership Appointments to Accelerate Innovation and Growth

08/28/2026 | Micron
Micron Technology, Inc. announced the promotion of two senior executives to newly expanded leadership roles designed to further strengthen the company's execution, innovation and long-term growth strategy.

Global Tier-1 YFORE Launches U.S. Manufacturing Factory in Atlanta

08/28/2026 | PRNewswire
YFORE officially inaugurated its new 62,225 sq. ft. American Headquarters in Suwanee, Georgia. Integrating R&D, manufacturing, procurement, sales, and delivery, the facility brings agile engineering and resilient local supply chains directly to local automotive partners.

I-Connect007 Welcomes Newest Columnist, Tianming Liu, FS Quality

08/27/2026 | I-Connect007
I-Connect007 is excited to announce its newest columnist, Tianming Liu, founder of First Quality Circuit Co. Ltd. (FS Quality) and Fuji PCB. His new column, Bridging the Pacific, will draw on more than three decades of experience in PCB manufacturing to explore the different manufacturing cultures, practices, and perspectives found across the global electronics industry.

North American PCB Demand Strengthens as July Bookings Surge 62%

08/25/2026 | Global Electronics Association
The Global Electronics Association announced the July 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.46.

North American EMS Orders Surge in July as Book-to-Bill Stands at 1.29

08/25/2026 | Global Electronics Association
The Global Electronics Association announced today the July 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in